Patents by Inventor Umeo Osio

Umeo Osio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor fabrication method and apparatus, and semiconductor device
    Publication number: 20030230794
    Abstract: A semiconductor fabrication method includes the steps of bonding each a plurality of bonding pads provided in a die and a circuit board using wire, coating an interface between the bonding pad and the wire with a buffer material, and sealing part of the die and the circuit board.
    Type: Application
    Filed: April 16, 2003
    Publication date: December 18, 2003
    Applicant: FUJITSU LIMITED
    Inventors: Yoshiaki Narita, Umeo Osio