Patents by Inventor Uming T. Jeng
Uming T. Jeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12100772Abstract: A solar cell design includes fabricating one or more gridlines for extracting photo-current on a front surface of the solar cell, wherein each of the gridlines is a metal grid and a cap layer, and at least a portion of the metal grid is deposited on the cap layer; and controlling an alignment of the metal grid relative to the cap layer, and a width of the cap layer relative to a width of the metal grid, so that a minimum cap edge offset distance value is about 1 ?m or more. The alignment of the metal grid relative to the cap layer and the width of the cap layer relative to the width of the metal grid are controlled at areas on the front surface of the solar cell opposite where welding occurs on a back-side of the solar cell. The alignments and widths of the metal grid relative to the cap layer are controlled by a photomask.Type: GrantFiled: June 4, 2019Date of Patent: September 24, 2024Assignee: THE BOEING COMPANYInventors: Philip T. Chiu, Peter Hebert, Uming T. Jeng, Christopher M. Fetzer, Moran Haddad, Dennis G. Hom, Joseph P. O'Day
-
Patent number: 11139407Abstract: A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.Type: GrantFiled: January 16, 2019Date of Patent: October 5, 2021Assignee: The Boeing CompanyInventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut
-
Publication number: 20200388715Abstract: A solar cell design includes fabricating one or more gridlines for extracting photo-current on a front surface of the solar cell, wherein each of the gridlines is a metal grid and a cap layer, and at least a portion of the metal grid is deposited on the cap layer; and controlling an alignment of the metal grid relative to the cap layer, and a width of the cap layer relative to a width of the metal grid, so that a minimum cap edge offset distance value is about 1 ?m or more. The alignment of the metal grid relative to the cap layer and the width of the cap layer relative to the width of the metal grid are controlled at areas on the front surface of the solar cell opposite where welding occurs on a back-side of the solar cell. The alignments and widths of the metal grid relative to the cap layer are controlled by a photomask.Type: ApplicationFiled: June 4, 2019Publication date: December 10, 2020Applicant: The Boeing CompanyInventors: Philip T. Chiu, Peter Hebert, Uming T. Jeng, Christopher M. Fetzer, Moran Haddad, Dennis G. Hom, Joseph P. O'Day
-
Publication number: 20190148572Abstract: A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.Type: ApplicationFiled: January 16, 2019Publication date: May 16, 2019Applicant: The Boeing CompanyInventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut
-
Patent number: 10224440Abstract: A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.Type: GrantFiled: April 17, 2017Date of Patent: March 5, 2019Assignee: The Boeing CompanyInventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut
-
Publication number: 20170222070Abstract: A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.Type: ApplicationFiled: April 17, 2017Publication date: August 3, 2017Applicant: The Boeing CompanyInventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut
-
Publication number: 20130240009Abstract: A solar cell assembly including a semiconductor wafer having a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and an electrical contact material positioned on the solar cell portion, wherein the wing portion is substantially free of the electrical contact material.Type: ApplicationFiled: March 18, 2012Publication date: September 19, 2013Applicant: The Boeing CompanyInventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut