Abstract: A semiconductor package includes a first structure, a first semiconductor chip on the first structure, a first conductive pad on the first structure between the first structure and the first semiconductor chip, a second conductive pad on a lower surface of the first semiconductor chip and vertically overlapping the first conductive pad, a bump connecting the first conductive pad and the second conductive pad, a first adhesive layer surrounding at least a part of side walls of the bump and side walls of the first conductive pad, and a second adhesive layer surrounding at least a part of the side walls of the bump and side walls of the second conductive pad, the second adhesive layer including a material different from the first adhesive layer, wherein a horizontal width of the first adhesive layer is smaller than a horizontal width of the second adhesive layer.

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a first semiconductor chip, a lower adhesion layer on the first semiconductor chip, a second semiconductor chip on the lower adhesion layer, an upper adhesion layer on the second semiconductor chip, and a third semiconductor chip on the upper adhesion layer. The lower adhesion layer includes a first cutting surface connected to a top surface of the lower adhesion layer. The upper adhesion layer is in contact with the first cutting surface of the lower adhesion layer.

Abstract: A semiconductor package including a first stack; a plurality of TSVs passing through the first stack; a second stack on the first stack and including a second surface facing a first surface of the first stack; a first pad on the first stack and in contact with the TSVs; a second pad on the second stack; a bump connecting the first and second pads; a first redundancy pad on the first surface of the first stack, spaced apart from the first pad, and not in contact with the TSVs; a second redundancy pad on the second surface of the second stack and spaced apart from the second pad; and a redundancy bump connecting the first redundancy pad and the second redundancy pad, wherein the first pad and first redundancy pad are electrically connected to each other, and the second pad and second redundancy pad are electrically connected to each other.

Abstract: Disclosed is a negative active material composition for a rechargeable lithium battery, a method of producing a negative electrode for a rechargeable lithium battery using the same, and a rechargeable lithium battery using the same. The negative active material composition includes a negative active material, an additive capable of forming a surface electrolyte interface film on a negative electrode during charge and discharge, a binder, and an organic solvent.

Abstract: A protector, and a lithium secondary battery having the protector, includes a positive temperature coefficient element (PTC) for interrupting current induced due to increased resistance when the temperature rises, a first lead made of aluminum or an aluminum alloy, and a second lead as an output terminal led from the PTC and made of nickel or a nickel alloy.

Abstract: Disclosed is a negative active material composition for a rechargeable lithium battery, a method of producing a negative electrode for a rechargeable lithium battery using the same, and a rechargeable lithium battery using the same. The negative active material composition includes a negative active material, an additive capable of forming a surface electrolyte interface film on a negative electrode during charge and discharge, a binder, and an organic solvent.

Abstract: A secondary battery includes a can into which an electrode assembly is inserted, a cap assembly mounted to an opening of the can; and an electolyte injection hole formed on at least one of the can and cap assembly, and safety member to close the electolyte injection hole. The electolyte injection hole is formed on a negative portion of the cap assembly. The safety member is inserted into and welded on the electolyte injection hole.

Abstract: A secondary battery includes a can into which an electrode assembly is inserted, a cap assembly mounted to an opening of the can; and an electrolyte injection hole formed on at least one of the can and cap assembly, and a safety member to close the electrolyte injection hole. The electrolyte injection hole is formed on a negative portion of the cap assembly or on the can. The safety member is inserted into and welded on the electrolyte injection hole. Also, a secondary battery, includes a can, a cap assembly on an end of the can, an electrolyte injection hole formed on the cap assembly, means for closing the electrolyte injection hole, and a safety member provided on the can, the safety member for reducing pressure inside the can once the pressure inside the can exceeds a predetermined level.

Abstract: A secondary battery comprises a can into which an electrode assembly is inserted, a cap assembly mounted to an opening of the can; and an electrolyte injection hole formed on at least one of the can and cap assembly, and a safety member to close the electrolyte injection hole. The electrolyte injection hole is formed on a negative portion of the cap assembly. The safety member is inserted into and welded on the electrolyte injection hole.