Patents by Inventor Unal M. GURUZ

Unal M. GURUZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer grounding design for single pad lapping
    Patent number: 8956200
    Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: February 17, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: David P. Druist, Glenn P. Gee, Unal M. Guruz, Edward H. Lee, David J. Seagle, Darrick T. Smith
  • WAFER GROUNDING DESIGN FOR SINGLE PAD LAPPING
    Publication number: 20140154952
    Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 5, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: David P. DRUIST, Glenn P. GEE, Unal M. GURUZ, Edward H. LEE, David J. SEAGLE, Darrick T. SMITH