Abstract: A process for machining a row of magnetic read-write head sliders involves setting, for the row of sliders, (a) a wedge angle that corresponds to an angle relative to the direction of the reader-writer offset (e.g., the y-axis) and (b) a read-write error correction process control that corresponds to a machining profile according to which the row is machined along the direction of the row (e.g., the x-axis). The row of sliders is then machined simultaneously according to the set wedge angle and the set read-write error correction control process, effectively providing multiple-axis machining control for varying reader and writer dimensional control along a row. Thus, a slider at one end of the row may be machined at a different angle, relative to the x-axis, than a slider at the opposite end of the row.

Abstract: A method for manufacturing a magnetic head for magnetic data recording, that allows a lapping termination point to be easily and accurately determined during lapping. The method includes constructing a lapping guide that has an electrically is formed to provide an abrupt change in resistance at a point where lapping should be terminated. This point of abrupt resistance change is located relative to the flare point of the write pole that the distance between the flare point and the air bearing surface can be accurately maintained. This abrupt resistance change also makes it possible to monitor both a stripe height defining rough lapping and an angled kiss lapping process using a single measurement channel.

Abstract: A method for manufacturing a magnetic head for magnetic data recording, that allows a lapping termination point to be easily and accurately determined during lapping. The method includes constructing a lapping guide that has an electrically is formed to provide an abrupt change in resistance at a point where lapping should be terminated. This point of abrupt resistance change is located relative to the flare point of the write pole that the distance between the flare point and the air bearing surface can be accurately maintained. This abrupt resistance change also makes it possible to monitor both a stripe height defining rough lapping and an angled kiss lapping process using a single measurement channel.

Abstract: Both the wafer serial number and slider region location indicia on the wafer are formed on the front surface of the wafer using optical principles, i.e., without using a laser.