Abstract: The present application can provide an electrode, a method of manufacturing an electrode, and a use of the electrode. The present application can provide an electrode without forming the fat edge portion while an insulating layer formed by overlapping with the electrode active material layer on the current collector layer of the electrode effectively secures the insulation required for the electrode. In addition, even when the electrode design model is changed, the present application can provide a manufacturing method capable of manufacturing the above-described electrode by flexibly responding to the relevant change. In addition, the present application can provide a use of the electrode.

Abstract: A microelectromechanical system (MEMS) probe for electric connection between a tested contact point of an object to be tested and a testing contact point of a test circuit. The MEMS probe includes: a first terminal contact portion; a second terminal contact portion movable close to and away from the first terminal contact portion; and an elastic connecting portion connecting the first terminal contact portion and the second terminal contact portion, elastically deformed by an approach of the second terminal contact portion and comprising a plurality of plating layers stacked in the elastic deformation direction. According to the present disclosure, the MEMS probe includes a plurality of plating layers stacked in the elastic deformation direction, thereby decreasing fatigue failure and improving durability.

Abstract: A test probe for testing electric characteristics of an object to be tested. The test probe includes: a first contact portion; a second contact portion movable close to or away from the first contact portion; and an elastic deformation portion connecting the first contact portion and the second contact portion and elastically deformed by compression in a probe axial line direction, wherein at least one of the first contact portion and the second contact portion comprises a plurality of split contact portions separated by a first slit formed along a lengthwise direction. According to the present disclosure, the plurality of split contact portions are configured to independently contact the tested contact point of the object to be tested, thereby not only enhancing contact reliability but also securing contact reliability by an alternative split contact portion even though one of the split contact portions is defective or damaged.

Abstract: A test device for testing electric characteristics of an object to be tested. The test device includes: a first support member comprising a plurality of guide holes; a second support member comprising a plurality of terminal holes and arranged to be spaced apart from and in parallel with the first support member; a plurality of main contact probes; and a plurality of sub contact probes arranged to be adjacent to the main contact probes along a lengthwise direction. According to the present disclosure, contact reliability is improved by multi contact with the terminal of the test circuit board (interposer) and/or the object to be tested.

Abstract: A microelectromechanical system (MEMS) probe for electric connection between a tested contact point of an object to be tested and a testing contact point of a test circuit. The MEMS probe includes: a first terminal contact portion; a second terminal contact portion movable close to and away from the first terminal contact portion; and an elastic connecting portion connecting the first terminal contact portion and the second terminal contact portion, elastically deformed by an approach of the second terminal contact portion and comprising a plurality of plating layers stacked in the elastic deformation direction. According to the present disclosure, the MEMS probe includes a plurality of plating layers stacked in the elastic deformation direction, thereby decreasing fatigue failure and improving durability.

Abstract: A test probe for testing electric characteristics of an object to be tested. The test probe includes: a first contact portion; a second contact portion movable close to or away from the first contact portion; and an elastic deformation portion connecting the first contact portion and the second contact portion and elastically deformed by compression in a probe axial line direction, wherein at least one of the first contact portion and the second contact portion comprises a plurality of split contact portions separated by a first slit formed along a lengthwise direction. According to the present disclosure, the plurality of split contact portions are configured to independently contact the tested contact point of the object to be tested, thereby not only enhancing contact reliability but also securing contact reliability by an alternative split contact portion even though one of the split contact portions is defective or damaged.

Abstract: A test device for testing electric characteristics of an object to be tested. The test device includes: a first support member comprising a plurality of guide holes; a second support member comprising a plurality of terminal holes and arranged to be spaced apart from and in parallel with the first support member; a plurality of main contact probes; and a plurality of sub contact probes arranged to be adjacent to the main contact probes along a lengthwise direction. According to the present disclosure, contact reliability is improved by multi contact with the terminal of the test circuit board (interposer) and/or the object to be tested.

Abstract: A probe card includes a probe, a circuit board, a first reinforcing plate and a second reinforcing plate. The probe makes contact with an object. The circuit board is electrically connected to the probe. The first reinforcing plate has a first tap and a second tap for providing an adjustable gap between the first reinforcing plate and an upper surface of the circuit board. The second reinforcing plate is positioned under a lower surface of the circuit board. The second reinforcing plate combined with the second tap to form an adjustable gap between the second reinforcing plate and a lower surface of the circuit board.

Abstract: A probe card includes a probe, a circuit board, a first reinforcing plate and a second reinforcing plate. The probe makes contact with an object. The circuit board is electrically connected to the probe. The first reinforcing plate has a first tap and a second tap for providing an adjustable gap between the first reinforcing plate and an upper surface of the circuit board. The second reinforcing plate is positioned under a lower surface of the circuit board. The second reinforcing plate combined with the second tap to form an adjustable gap between the second reinforcing plate and a lower surface of the circuit board.

Abstract: A probe card locking device of a semiconductor wafer probe station for locking a probe card by using a tensile force of springs solves an unbalance issue in a locking operation, facilitates the operation via an automation and shortens setup time. A pair of frames are respectively formed with support steps for supporting both sides of a probe card and installed in a tester head in parallel with each other to be spaced apart by a prescribed distance. A pair of locking members have pressing steps for pressing both sides of the probe card from above supported by the support steps of the frames. Plural springs are installed between the locking members and frames for elastically supporting the locking members for allowing a close attachment to the frames with a prescribed force for locking the probe card.