Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; and an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip.

Abstract: A semiconductor chip includes: a body; holes disposed in a first surface of the body; and a warpage preventing member including filling members disposed in the holes.

Abstract: There are provided a printed circuit board and a method to manufacture the same. The printed circuit board includes a core board including an insulating layer and a cavity, an electronic element in the cavity, and an insulating member disposed between inner surfaces of the cavity and the electronic element. A modulus of elasticity of the insulating member is lower than a modulus of elasticity of the insulating layer.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; and an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; and an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip.

Abstract: An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity, a redistribution layer disposed adjacent to the frame and electrically connected to the electronic component, and an encapsulation material encapsulating the electronic component and having an elastic modulus smaller than that of a material constituting the frame.

Abstract: An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity, a redistribution layer disposed adjacent to the frame and electrically connected to the electronic component, and an encapsulation material encapsulating the electronic component and having an elastic modulus smaller than that of a material constituting the frame.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; and an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip.

Abstract: An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity, a redistribution layer disposed adjacent to the frame and electrically connected to the electronic component, and an encapsulation material encapsulating the electronic component and having an elastic modulus smaller than that of a material constituting the frame.

Abstract: A semiconductor chip includes: a body; holes disposed in a first surface of the body; and a warpage preventing member including filling members disposed in the holes.

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a core board having a cavity that penetrates through a region of a core layer, an electronic component embedded in the cavity, side surfaces of the cavity contacting the electronic component, and insulating layers disposed on opposite surfaces of the core board.

Abstract: There are provided a printed circuit board and a method to manufacture the same. The printed circuit board includes a core board including an insulating layer and a cavity, an electronic element in the cavity, and an insulating member disposed between inner surfaces of the cavity and the electronic element. A modulus of elasticity of the insulating member is lower than a modulus of elasticity of the insulating layer.