Patents by Inventor Unmesh Agarwala
Unmesh Agarwala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8649256Abstract: A router includes multiple routing engines. If the active routing engine fails, a backup one of the routing engines detects the failure and assumes the role of active routing engine. A redundancy controller circuit, connected to the multiple routing engines, facilitates the selection and switching of the routing engines. Portions of the packet forwarding engine, in addition to the routing engine, may be redundantly implemented. The active routing engine controls the selection of the redundant portion of the packet forwarding engine.Type: GrantFiled: September 3, 2010Date of Patent: February 11, 2014Assignee: Juniper Networks, Inc.Inventors: Anis Haq, Lawrence Hui, Scott Chew, Unmesh Agarwala, Michael Beesley
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Publication number: 20110103220Abstract: A router includes multiple routing engines. If the active routing engine fails, a backup one of the routing engines detects the failure and assumes the role of active routing engine. A redundancy controller circuit, connected to the multiple routing engines, facilitates the selection and switching of the routing engines. Portions of the packet forwarding engine, in addition to the routing engine, may be redundantly implemented. The active routing engine controls the selection of the redundant portion of the packet forwarding engine.Type: ApplicationFiled: September 3, 2010Publication date: May 5, 2011Applicant: JUNIPER NETWORKS, INC.Inventors: Anis HAQ, Lawrence HUI, Scott CHEW, Unmesh AGARWALA, Michael BEESLEY
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Patent number: 7813264Abstract: A router includes multiple routing engines. If the active routing engine fails, a backup one of the routing engines detects the failure and assumes the role of active routing engine. A redundancy controller circuit, connected to the multiple routing engines, facilitates the selection and switching of the routing engines. Portions of the packet forwarding engine, in addition to the routing engine, may be redundantly implemented. The active routing engine controls the selection of the redundant portion of the packet forwarding engine.Type: GrantFiled: March 21, 2005Date of Patent: October 12, 2010Assignee: Juniper Networks, Inc.Inventors: Anis Haq, Lawrence Hui, Scott Chew, Unmesh Agarwala, Michael Beesley
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Publication number: 20050163044Abstract: A router includes multiple routing engines. If the active routing engine fails, a backup one of the routing engines detects the failure and assumes the role of active routing engine. A redundancy controller circuit, connected to the multiple routing engines, facilitates the selection and switching of the routing engines. Portions of the packet forwarding engine, in addition to the routing engine, may be redundantly implemented. The active routing engine controls the selection of the redundant portion of the packet forwarding engine.Type: ApplicationFiled: March 21, 2005Publication date: July 28, 2005Inventors: Anis Haq, Lawrence Hui, Scott Chew, Unmesh Agarwala, Michael Beesley
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Patent number: 6885635Abstract: A router includes multiple routing engines. If the active routing engine fails, a backup one of the routing engines detects the failure and assumes the role of active routing engine. A redundancy controller circuit, connected to the multiple routing engines, facilitates the selection and switching of the routing engines. Portions of the packet forwarding engine, in addition to the routing engine, may be redundantly implemented. The active routing engine controls the selection of the redundant portion of the packet forwarding engine.Type: GrantFiled: November 21, 2000Date of Patent: April 26, 2005Assignee: Juniper Networks, Inc.Inventors: Anis Haq, Lawrence Hui, Scott Chew, Unmesh Agarwala, Michael Beesley
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Patent number: 6453406Abstract: In a data processing system of the type having multiple processor units coupled to one another by a bus means for interprocessor communications there is provided a fiber optic interconnection system to interconnect the bus means of multiple processor sections to one another, thereby allowing groups of the processor units to be physically spaced from one another. The fiber optic interconnect system includes, for each multiprocessor unit section functions to receive messages communicated on the interprocessor bus of that section for receipt by a destination processor of the other section, format the message for fiber optic transmission, and transmit the message; and circuitry for receiving messages on the fiber optic link, scheduling the message for transmission to the destination processor, and maintaining that scheduling in the face of receipt of another message for the same processor unit.Type: GrantFiled: December 13, 1993Date of Patent: September 17, 2002Assignee: Compaq Computer CorporationInventors: Scott Sarnikowski, Unmesh Agarwala, Stanley S. Quan, Charles E. Comstock, Frank G. Moore
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Patent number: 5999437Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.Type: GrantFiled: January 27, 1997Date of Patent: December 7, 1999Assignee: Silicon Graphics, Inc.Inventors: David P. Chengson, William L. Schmidt, Unmesh Agarwala, Alan D. Foster, Edward C. Priest, John C. Manton, Ali Mira
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Patent number: 5867419Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.Type: GrantFiled: July 29, 1997Date of Patent: February 2, 1999Assignee: Silicon Graphics, Inc.Inventors: David P. Chengson, William L. Schmidt, Unmesh Agarwala, Alan D. Foster, Edward C. Priest, John C. Manton, Ali Mira
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Patent number: 5710733Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.Type: GrantFiled: January 22, 1996Date of Patent: January 20, 1998Assignee: Silicon Graphics, Inc.Inventors: David P. Chengson, William L. Schmidt, Unmesh Agarwala, Alan D. Foster, Edward C. Priest, John C. Manton, Ali Mira