Patents by Inventor UPENDRA R. SHETH

UPENDRA R. SHETH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR STACKING WIRE-BOND CONVERTED FLIP-CHIP DIE
    Publication number: 20210202441
    Abstract: Various embodiments are generally directed to an electronic assembly comprising at least two dies stacked on top of each other. Metal columns of different heights electrically connect the dies to a system substrate.
    Type: Application
    Filed: February 5, 2016
    Publication date: July 1, 2021
    Applicant: INTEL CORPORATION
    Inventors: ENG HUAT GOH, CHU AUN LIM, UPENDRA R. SHETH, ROBERT STARKSTON