Patents by Inventor Uppalapati V. Ramgopal

Uppalapati V. Ramgopal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Distributed load board stiffener
    Patent number: 6512678
    Abstract: An apparatus, and method for using same, is described for a distributed load board stiffener. The apparatus may include a body having a central axis portion and multiple protusions extending away from the central axis portion towards respective ends. Each of the ends of the protrusions having a mounting point to mount a printed circuit board to a chassis support. The protrusions may operate to mount the board stiffener to a printed circuit board away from trace routing areas disposed centrally on the printed circuit board. The protrusions may operate to distribute a load around a periphery of the printed circuit board.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: January 28, 2003
    Assignee: Intel Corporation
    Inventors: Rob W. Sims, Uppalapati V. Ramgopal, Ronald C. Flamm, Michael Z. Eckblad
  • Distributed load board stiffener
    Publication number: 20020141165
    Abstract: An apparatus, and method for using same, is described for a distributed load board stiffener. The apparatus may include a body having a central axis portion and multiple protrusions extending away from the central axis portion toward respective ends. Each of the ends of the protrusions having a mounting point to amount a printed circuit board to a chassis support. The protrusions may operate to mount the board stiffener to a printed circuit board away from trace routing areas disposed centrally on the printed circuit board. The protrusions may operate to distribute a load around a periphery of the printed circuit board.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 3, 2002
    Inventors: Rob W. Sims, Uppalapati V. Ramgopal, Ronald C. Flamm, Michael Z. Eckblad