Abstract: An improved heat exchange device adaptable for cooling electronic components mounted over at least one external surface of the device, comprising a base plate; a cover plate; a clad plate interposed between the base plate and the cover plate, the base plate and the cover plate, with the clad sheet being rigidly jointed to form a single integrated plate; at least one inlet port and at least one outlet port atone end and/or at the opposite ends of the formed plate for entry and exit of a cooling medium, wherein the base plate is configured to have a plurality of flow-passages each comprising several machined grooves having varied dimensions predetermined in registration with respective thermal footprint of the electronic components thereby optimizing the heat transfer rate, and in that a plurality of interconnections being designed between the grooves constituting one of a series and parallel flow-paths.