Abstract: An improved method and apparatus for the visual alignment and placement of electrical components, such as lead-carrying chip members, and pad members, such as pad-carrying printed circuit boards, for purposes of aligning, placing and soldering said leads to said pads. The method involves supporting the chip member vertically over said pad member, inteposing therebetween a beam splitter cube which provides a simultaneous view of the underside of the chip member and the surface of the pad when viewed through a stereo microscope means, interposing an adjustable polarizing filter means which permits the operator to adjust the visual contrast between the leads and the pads, thereby facilitating the proper X, Y and theta vertical alignment, and moving the component down onto the pad member for soldering thereto.