Patents by Inventor Urs-Detlev Schoop

Urs-Detlev Schoop has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Architecture for high temperature superconductor wire
    Patent number: 7816303
    Abstract: A laminated superconductor wire includes a superconductor wire assembly, which includes a first superconductor insert comprising a first high temperature superconductor layer overlaying a first substrate and a second superconductor insert comprising a second high temperature superconductor layer overlaying a second substrate. The first and second superconductor inserts are joined together at their respective substrates. An electrically conductive structure substantially surrounds the superconductor wire assembly.
    Type: Grant
    Filed: July 29, 2005
    Date of Patent: October 19, 2010
    Assignee: American Superconductor Corporation
    Inventors: Cornelis Leo Hans Thieme, Alexis P. Malozemoff, Martin W. Rupich, Urs-Detlev Schoop, Elliott D. Thompson, Darren Verebelyi
  • Deposition of buffer layers on textured metal surfaces
    Patent number: 7261776
    Abstract: A method of making a multilayer article includes depositing a first material on the surface of a metal substrate to form a seed layer of the first material, the first material being deposited under reducing conditions relative to the metal substrate, and then epitaxially depositing a second material on a surface of the seed layer, wherein the second material is deposited from a solution-based precursor under second conditions that are more oxidizing than the reducing conditions used in the deposition of the first material.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: August 28, 2007
    Assignee: American Superconductor Corporation
    Inventors: Martin W. Rupich, Urs-Detlev Schoop, Darren Verebelyi, Thomas Kodenkandath, Xiaoping Li
  • Architecture for high temperature superconductor wire
    Publication number: 20060073979
    Abstract: A laminated superconductor wire includes a superconductor wire assembly, which includes a first superconductor insert comprising a first high temperature superconductor layer overlaying a first substrate and a second superconductor insert comprising a second high temperature superconductor layer overlaying a second substrate. The first and second superconductor inserts are joined together at their respective substrates. An electrically conductive structure substantially surrounds the superconductor wire assembly.
    Type: Application
    Filed: July 29, 2005
    Publication date: April 6, 2006
    Inventors: Cornelis Thieme, Alexis Malozemoff, Martin Rupich, Urs-Detlev Schoop, Elliott Thompson, Darren Verebelyi
  • Deposition of buffer layers on textured metal surfaces
    Publication number: 20050217568
    Abstract: A method of making a multilayer article includes depositing a first material on the surface of a metal substrate to form a seed layer of the first material, the first material being deposited under reducing conditions relative to the metal substrate, and then epitaxially depositing a second material on a surface of the seed layer, wherein the second material is deposited from a solution-based precursor under second conditions that are more oxidizing than the reducing conditions used in the deposition of the first material.
    Type: Application
    Filed: March 30, 2004
    Publication date: October 6, 2005
    Applicant: American Superconductor Corporation
    Inventors: Martin Rupich, Urs-Detlev Schoop, Darren Verebelyi, Thomas Kodenkandath, Xiaoping Li
  • Superconductor methods and reactors
    Publication number: 20050065035
    Abstract: Superconductor reactors, methods and systems are disclosed.
    Type: Application
    Filed: June 1, 2004
    Publication date: March 24, 2005
    Inventors: Martin Rupich, Darren Verebelyi, Xiaoping Li, Wei Zhang, Urs-Detlev Schoop, Joseph Lynch
  • Multi-layer superconductor having buffer layer with oriented termination plane
    Patent number: 6537689
    Abstract: The invention relates to multi-layer articles and methods of making such articles. The multi-layer superconductors can have one or more layers with an oriented termination plane. The methods include first conditioning the termination plane of an underlying layer, such as a buffer layer or a superconductor layer, then disposing a layer of material on the conditioned termination plane. The conditioned termination plane can be a high quality termination plane. Superconductor articles formed by these methods can exhibit relatively high critical current densities.
    Type: Grant
    Filed: November 26, 2001
    Date of Patent: March 25, 2003
    Assignee: American Superconductor Corporation
    Inventors: Urs-Detlev Schoop, Suresh Annavarapu, Martin W. Rupich, Xiaoping Li, Wei Zhang, Edward J. Siegal, Qi Li
  • Multi-layer superconductor having buffer layer with oriented termination plane
    Publication number: 20020082171
    Abstract: The invention relates to multi-layer articles and methods of making such articles. The multi-layer superconductors can have one or more layers with an oriented termination plane. The methods include first conditioning the termination plane of an underlying layer, such as a buffer layer or a superconductor layer, then disposing a layer of material on the conditioned termination plane. The conditioned termination plane can be a high quality termination plane. Superconductor articles formed by these methods can exhibit relatively high critical current densities.
    Type: Application
    Filed: November 26, 2001
    Publication date: June 27, 2002
    Inventors: Urs-Detlev Schoop, Suresh Annavarapu, Martin W. Rupich, Xioping Li, Wei Zhang, Edward J. Siegal, Qi Li