Abstract: Methods and apparatuses are disclosed for laser processing. A method includes providing a laser beam transparent to a workpiece. A cover, having a surface quality better than the workpiece's surface, is provided and spaced apart from the workpiece's surface. A fluid is provided between and in contact with the cover and the workpiece's surface. A laser beam is directed through the cover and fluid to the workpiece. An apparatus includes a cover spaced apart from a workpiece's surface and including a surface quality better than the workpiece's surface, a fluid dispenser for introducing fluid between and in contact with the cover and the workpiece's surface, and a laser system that directs a laser beam through the cover and fluid to the workpiece.

Abstract: Laser radiation is used for removing brittle-hard material from a substrate without damaging the material. A removal depression having a flank angle w of the flanks of the removal depression forms in the material as a result of the removal. The removal depression forms with an entry edge, which is defined as a spatially expanded region of the surface of the material, where an unchanged and thus unremoved portion of the surface of the material transitions into the removal depression. Spatial portions of the laser radiation are refracted and focused into the volume of the unremoved material at this entry edge. The distribution of the laser radiation is set such that the entry edge assumes a small spatial expansion, such that the portion of the power of the laser radiation, which is captured by the focusing effect of the entry edge, is not sufficient to generate a threshold value ?damage for the electron density in the volume of the material, thus avoiding damage to the material.