Abstract: The method of manufacturing a functional inlay comprises the steps of: a support layer with at least a first and a second side a wire antenna in said support layer processing said support layer with said embedded wire antenna to a connection station in which said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; said support layer is approached on said second side by a connection device; and said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

Abstract: The method of manufacturing a functional inlay comprises the steps of: a support layer with at least a first and a second side a wire antenna in said support layer processing said support layer with said embedded wire antenna to a connection station in which said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; said support layer is approached on said second side by a connection device; and said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

Abstract: The method of manufacturing a functional inlay comprises the steps of: —) providing a support layer with at least a first and a second side —) embedding a wire antenna in said support layer —) processing said support layer with said embedded wire antenna to a connection station in which —) said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; —) said support layer is approached on said second side by a connection device; and —) said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

Abstract: The method of manufacturing a functional inlay comprises the steps of: —providing a support layer with at least a first and a second side —embedding a wire antenna in said support layer —processing said support layer with said embedded wire antenna to a connection station in which —said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; —said support layer is approached on said second side by a connection device; and —said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

Abstract: A solar heat collector is presented for heating a circulating fluid with an inner glass tube and an outer glass tube. The glass tubes are connected at their open ends, and the space between the inner tube and the outer tube being evacuated, wherein the inner space of the inner tube is divided by an insert to define a first channel and a second channel. Said channels are connected at the closed end of the inner tube. The inner glass tube and the outer glass tube have smooth inner and outer surfaces, and the insert is provided such that the first and second channels and a space between the end of the insert and the closed end of the inner tube define the same cross-section.

Abstract: A transponder device for the identification of objects in front of pieces of equipment, with an integrated switching circuit, with a first driver and with a carrier accommodating a circuit, whereby the first driver and the switching circuit are deposited on a first surface of the carrier, and whereby a plurality of contract points are deposited on a second surface of the carrier. In order to make available a transponder device with which the integrated switching circuit of the transponder can be used from outside the encapsulation and on repeated occasions, provision is made such that the integrated switching circuit and the first driver are encapsulated with the carrier in such a way that the integrated switching circuit and the first driver can be contacted electronically from outside the encapsulation solely via the contact points, and that the integrated switching circuit encodes the first signal for the first driver.

Abstract: The invention relates to a transponder device which comprises a chip (5) and an antenna (8), the chip (5) being connected to the antenna (8), the transponder is characterized by the fact that the chip (5) is packed with a protective and insulating layer (14) of at least 30 ?m thick, the layer being at least arranged between the chip (5) and the antenna (8), the antenna (8) being connected to the chip (5) through said layer (14).

Abstract: The invention relates to a transponder device for the identification of objects in front of pieces of equipment, with an integrated switching circuit, with a first driver and with a carrier accommodating a circuit, whereby the first driver and the switching circuit are deposited on a first surface of the carrier, whereby a plurality of contact points are deposited on a second surface of the carrier, and whereby the contact points are connected electrically to the switching circuit and the first driver.