Patents by Inventor Urs Kloter
Urs Kloter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10278306Abstract: The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).Type: GrantFiled: February 26, 2015Date of Patent: April 30, 2019Assignee: GLOBAL FOUNDRIES INC.Inventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joseph Linderman, Bruno Michel, Hugo E. Rothuizen, Reto Waelchli
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Patent number: 10091909Abstract: The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).Type: GrantFiled: February 26, 2015Date of Patent: October 2, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joseph Linderman, Bruno Michel, Hugo E. Rothuizen, Reio Waelchli
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Publication number: 20150195955Abstract: The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).Type: ApplicationFiled: February 26, 2015Publication date: July 9, 2015Inventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joseph Linderman, Bruno Michel, Hugo E. Rothuizen, Reio Waelchli
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Patent number: 8413712Abstract: A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.Type: GrantFiled: November 13, 2006Date of Patent: April 9, 2013Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joesph Linderman, Bruno Michel, Hugo E. Rothuizen
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Publication number: 20130008632Abstract: A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader, and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.Type: ApplicationFiled: September 13, 2012Publication date: January 10, 2013Applicant: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joesph Linderman, Bruno Michel, Hugo E. Rothuizen
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Patent number: 8327540Abstract: A method for producing a plate with a first face with protrusions confined by first and second grooves includes steps of: etching recessed zones into a plate; depositing a photoresist layer on the plate; forming a passivation layer over the photoresist layer; removing the passivation layer at the bottom of the recessed zones; electroplating metal in the recessed zones; removing the passivation layer; removing the photoresist layer; and removing the semiconductor material to expose the first and second grooves.Type: GrantFiled: August 10, 2009Date of Patent: December 11, 2012Assignee: International Business Machines CorporationInventors: Bruno Michel, Thomas J. Brunschwiler, Hugo E. Rothuizen, Urs Kloter
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Publication number: 20120273183Abstract: A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass. A gear member is operatively connected between the mass and the force transfer member.Type: ApplicationFiled: July 11, 2012Publication date: November 1, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michel Bruno, Thomas Brunschwiler, Urs Kloter, Ryan J. Linderman, Erich Ruetsche
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Patent number: 8268544Abstract: A stamp for patterning onto a receiving surface of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface is planar at rest. The pattern is reproduced on the stamping surface and the diaphragm is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm can move along a direction perpendicular to the stamping surface. The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.Type: GrantFiled: December 1, 2005Date of Patent: September 18, 2012Assignees: Essilor International (Compagnie Generale d'Optique), International Business Machines CorporationInventors: Heinz Schmid, Bruno Michel, Urs Kloter, Gerhard Keller, Jean-Paul Cano
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Patent number: 7748440Abstract: The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.Type: GrantFiled: June 1, 2005Date of Patent: July 6, 2010Assignee: International Business Machines CorporationInventors: Bruno Michel, Thomas J. Brunschwiler, Hugo E. Rothuizen, Urs Kloter
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Publication number: 20100044005Abstract: A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass.Type: ApplicationFiled: August 20, 2008Publication date: February 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michel Bruno, Thomas Brunschwiler, Urs Kloter, Ryan J. Linderman, Erich Ruetsche
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Publication number: 20100037461Abstract: A method for producing a plate with a first face with protrusions confined by first and second grooves includes steps of: etching recessed zones into a plate; depositing a photoresist layer on the plate; forming a passivation layer over the photoresist layer; removing the passivation layer at the bottom of the recessed zones; electroplating metal in the recessed zones; removing the passivation layer; removing the photoresist layer; and removing the semiconductor material to expose the first and second grooves.Type: ApplicationFiled: August 10, 2009Publication date: February 18, 2010Applicant: International Business Machines CorporationInventors: Bruno Michel, Thomas J. Brunschwiler, Hugo E. Rothuizen, Urs Kloter
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Publication number: 20090208882Abstract: A stamp for patterning onto a receiving surface of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface is planar at rest. The pattern is reproduced on the stamping surface and the diaphragm is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm can move along a direction perpendicular to the stamping surface. The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.Type: ApplicationFiled: December 1, 2005Publication date: August 20, 2009Inventors: Heinz Schmid, Bruno Michel, Urs Kloter, Gerhard Keller, Jean-Paul Cano
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Patent number: 7547582Abstract: A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the semiconductor device which enhances the reliability of the semiconductor device. In one of the embodiments the cap is modified with an integrated, confined, and high thermal adaptive material. The membrane on this system is highly flexible. The cap is preassembled to the chip at a temperature above liquidus below curing temperature of the adaptive material. At this state, a hydrostatic pressure in the material develops due to the compression exerted from the cap to the chip and the confined volume of the buried material. This hydrostatic pressure causes the membrane to deflect and to adapt the warping and tolerances of the chip. Due to the adaptive surface the gap on each position of the chip and from chip to chip is same.Type: GrantFiled: September 26, 2006Date of Patent: June 16, 2009Assignee: International Business Machines CorporationInventors: Thomas J Brunschwiler, Bruno Michel, Ryan Joseph Linderman, Urs Kloter, Hugo E Rothuizen
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Patent number: 7532475Abstract: A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.Type: GrantFiled: March 30, 2006Date of Patent: May 12, 2009Assignee: International Business Machines CorporationInventors: Bruno Michel, Thomas J. Brunschwiler, Ryan J. Linderman, Hugo E. Rothuizen, Urs Kloter
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Publication number: 20080073775Abstract: A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the semiconductor device which enhances the reliability of the semiconductor device. In one of the embodiments the cap is modified with an integrated, confined, and high thermal adaptive material. The membrane on this system is highly flexible. The cap is preassembled to the chip at a temperature above liquidus below curing temperature of the adaptive material. At this state, a hydrostatic pressure in the material develops due to the compression exerted from the cap to the chip and the confined volume of the buried material. This hydrostatic pressure causes the membrane to deflect and to adapt the warping and tolerances of the chip. Due to the adaptive surface the gap on each position of the chip and from chip to chip is same.Type: ApplicationFiled: September 26, 2006Publication date: March 27, 2008Inventors: Thomas J Brunschwiler, Bruno Michel, Ryan Joseph Linderman, Urs Kloter, Hugo E Rothuizen
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Patent number: 7282799Abstract: An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.Type: GrantFiled: May 19, 2006Date of Patent: October 16, 2007Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joesph Linderman, Bruno Michel, Hugo E. Rothuizen
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Publication number: 20070230133Abstract: A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.Type: ApplicationFiled: March 30, 2006Publication date: October 4, 2007Applicant: International Business Machines CorporationInventors: Bruno Michel, Thomas Brunschwiler, Ryan Linderman, Hugo Rothuizen, Urs Kloter
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Publication number: 20070119565Abstract: A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.Type: ApplicationFiled: November 13, 2006Publication date: May 31, 2007Applicant: International Business Machines CorporationInventors: Thomas Brunschwiler, Urs Kloter, Ryan Linderman, Bruno Michel, Hugo Rothuizen
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Publication number: 20070017659Abstract: A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader, and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.Type: ApplicationFiled: June 28, 2006Publication date: January 25, 2007Applicant: International Business Machines CorporationInventors: Thomas Brunschwiler, Urs Kloter, Ryan Linderman, Bruno Michel, Hugo Rothuizen
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Publication number: 20060286712Abstract: An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.Type: ApplicationFiled: May 19, 2006Publication date: December 21, 2006Applicant: International Business Machines CorporationInventors: Thomas Brunschwiler, Urs Kloter, Ryan Linderman, Bruno Michel, Hugo Rothuizen