Patents by Inventor Urs Otto HÄFELI

Urs Otto HÄFELI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallic microneedles
    Patent number: 10589078
    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: March 17, 2020
    Assignee: Microdermics Inc.
    Inventors: Boris Stoeber, Iman Mansoor, Urs Otto Häfeli
  • METALLIC MICRONEEDLES
    Publication number: 20190201674
    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 4, 2019
    Inventors: Boris STOEBER, Iman MANSOOR, Urs Otto HÄFELI
  • Metallic microneedles
    Patent number: 10207094
    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: February 19, 2019
    Assignee: Microdermics Inc.
    Inventors: Boris Stoeber, Iman Mansoor, Urs Otto Häfeli
  • METALLIC MICRONEEDLES
    Publication number: 20170312489
    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
    Type: Application
    Filed: May 15, 2017
    Publication date: November 2, 2017
    Inventors: Boris STOEBER, Iman MANSOOR, Urs Otto HÄFELI
  • Metallic microneedles
    Patent number: 9675790
    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: June 13, 2017
    Assignee: Microdermics Inc.
    Inventors: Boris Stoeber, Iman Mansoor, Urs Otto Häfeli
  • METALLIC MICRONEEDLES
    Publication number: 20160158514
    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
    Type: Application
    Filed: December 10, 2015
    Publication date: June 9, 2016
    Inventors: Boris STOEBER, Iman MANSOOR, Urs Otto HÄFELI