Abstract: An improved method for avoiding mid-air collision in aviation is disclosed. The method relies on a calibration of radio signal intensities I with radio signal encoded position information L. In other words, after a first reception of a radio signal S advantageously comprising remote aircraft position information L, the radio signal intensity I is measured and a correction factor C is derived. During a next encounter of the radio signal S, a second distance estimation d can be derived using the signal intensity I and the correction factor C. Preferably, relative positioning data is acquired together with the correction factor C and a plurality of correction factors for different relative positions is combined in an at least partly continuous correction function.

Abstract: A method and device are disclosed for calibrating sensors, which sensors are arranged on semiconductor chips and are e.g. to be used for detecting a substance in a fluid. The sensors are calibrated while they are still assembled on a semiconductor wafer by exposing the wafer to a calibration fluid containing a known amount of the substance to be measured. Hence, rather than first cutting the wafer, the sensors are calibrated at an early stage. For this purpose, they are placed on a chuck below a lid. The calibration fluid with known parameters is introduced between the wafer and the lid. This allows to test and calibrate a large number of sensors quickly.

Abstract: The humidity detector comprises a housing adapted to hold a humidity sensor towards the windscreen of a vehicle or any other type of window. A flexible printed circuit board is arranged between the humidity sensor and the windscreen and provides a connection between the humidity sensor and further circuitry of the detector. The humidity sensor is located under a cap, which is engaged by a glider member. A spring pushes the glider member towards the windscreen.

Abstract: The device comprises a housing with two humidity sensors. A first opening of the housing is placed onto or into the soil, while a second opening is located outside the soil in communication with the environment. A chamber extends in the housing between the first and the second opening. This chamber allows humidity to diffuse between the openings. The humidity sensors are located to measure the humidity at two spaced apart locations within the chamber. The difference of humidity measured at these two locations is a measure of soil moisture content.

Abstract: The humidity detector comprises a housing adapted to hold a humidity sensor towards the windscreen of a vehicle or any other type of window. A flexible printed circuit board is arranged between the humidity sensor and the windscreen and provides a connection between the humidity sensor and further circuitry of the detector. The humidity sensor is located under a cap, which is engaged by a glider member. A spring pushes the glider member towards the windscreen.

Abstract: A method and device are disclosed for calibrating sensors, which sensors are arranged on semiconductor chips and are e.g. to be used for detecting a substance in a fluid. The sensors are calibrated while they are still assembled on a semiconductor wafer by exposing the wafer to a calibration fluid containing a known amount of the substance to be measured. Hence, rather than first cutting the wafer, the sensors are calibrated at an early stage. For this purpose, they are placed on a chuck below a lid. The calibration fluid with known parameters is introduced between the wafer and the lid. This allows to test and calibrate a large number of sensors quickly.

Abstract: A method and device are disclosed for calibrating sensors, which sensors are arranged on semiconductor chips and are e.g. to be used for detecting a substance in a fluid. The sensors are calibrated while they are still assembled on a semiconductor wafer by exposing the wafer to a calibration fluid containing a known amount of the substance to be measured. Hence, rather than first cutting the wafer, the sensors are calibrated at an early stage. For this purpose, they are placed on a chuck below a lid. The calibration fluid with known parameters is introduced between the wafer and the lid. This allows to test and calibrate a large number of sensors quickly.

Abstract: A method and device are disclosed for calibrating sensors, which sensors are arranged on semiconductor chips and are e.g. to be used for detecting a substance in a fluid. The sensors are calibrated while they are still assembled on a semiconductor wafer by exposing the wafer to a calibration fluid containing a known amount of the substance to be measured. Hence, rather than first cutting the wafer, the sensors are calibrated at an early stage. For this purpose, they are placed on a chuck below a lid. The calibration fluid with known parameters is introduced between the wafer and the lid. This allows to test and calibrate a large number of sensors quickly.