Abstract: An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

Abstract: An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

Abstract: A method and apparatus for a frequency-based slope-adjustment circuit block are described herein.

Abstract: A method and apparatus for a frequency-based slope-adjustment circuit block are described herein.

Abstract: A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated based on matching an internal impedance generated by transistors with an impedance of the external impedance element, and then the reference impedance code can be shifted to generate new impedance codes according to impedance requirements of various different circuits that require compensation. Use of the single external impedance element for compensation of multiple circuits reduces motherboard and packaging costs. Chip area is also conserved since simpler compensation circuits can be used.

Abstract: A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated from a master circuit, and then the reference impedance code is shifted to generate a slave impedance code. The slave impedance code is provided to one or more slave circuits to activate devices in the slave circuit(s). Impedance-generation devices coupled to the slave circuit are then activated one at a time until their generated impedance corresponds to the impedance generated by the slave circuit. The reference impedance code can be incremented or decremented (e.g., shifted) to generate slave impedance codes corresponding to different impedance values, according to impedance requirements of various different circuits that require compensation.

Abstract: A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated based on matching an internal impedance generated by transistors with an impedance of the external impedance element, and then the reference impedance code can be shifted to generate new impedance codes according to impedance requirements of various different circuits that require compensation. Use of the single external impedance element for compensation of multiple circuits reduces motherboard and packaging costs. Chip area is also conserved since simpler compensation circuits can be used.

Abstract: A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated from a master circuit, and then the reference impedance code is shifted to generate a slave impedance code. The slave impedance code is provided to one or more slave circuits to activate devices in the slave circuit(s). Impedance-generation devices coupled to the slave circuit are then activated one at a time until their generated impedance corresponds to the impedance generated by the slave circuit. The reference impedance code can be incremented or decremented (e.g., shifted) to generate slave impedance codes corresponding to different impedance values, according to impedance requirements of various different circuits that require compensation.

Abstract: A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated based on matching an internal impedance generated by transistors with an impedance of the external impedance element, and then the reference impedance code can be shifted to generate new impedance codes according to impedance requirements of various different circuits that require compensation. Use of the single external impedance element for compensation of multiple circuits reduces motherboard and packaging costs. Chip area is also conserved since simpler compensation circuits can be used.

Abstract: A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated from a master circuit, and then the reference impedance code is provided (as a slave impedance code) to one or more slave circuits to activate devices in the slave circuit(s). Impedance-generation devices coupled to the slave circuit are then activated one at a time until their generated impedance corresponds to the impedance generated by the slave circuit. The reference impedance code can be incremented or decremented (e.g., shifted) to generate slave impedance codes corresponding to different impedance values, according to impedance requirements of various different circuits that require compensation. Using the single external impedance element for compensation of multiple circuits reduces motherboard and packaging costs.

Abstract: A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated based on matching an internal impedance generated by transistors with an impedance of the external impedance element, and then the reference impedance code can be shifted to generate new impedance codes according to impedance requirements of various different circuits that require compensation. Use of the single external impedance element for compensation of multiple circuits reduces motherboard and packaging costs. Chip area is also conserved since simpler compensation circuits can be used.

Abstract: A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated from a master circuit, and then the reference impedance code is provided (as a slave impedance code) to one or more slave circuits to activate devices in the slave circuit(s). Impedance-generation devices coupled to the slave circuit are then activated one at a time until their generated impedance corresponds to the impedance generated by the slave circuit. The reference impedance code can be incremented or decremented (e.g., shifted) to generate slave impedance codes corresponding to different impedance values, according to impedance requirements of various different circuits that require compensation. Using the single external impedance element for compensation of multiple circuits reduces motherboard and packaging costs.

Abstract: A pull-up circuit has substantially linear current-voltage (I-V) characteristics for use in a bus system, such as in an open drain bus architecture type system. Operation in the linear region of the I-V characteristics is useful in high frequency input/output circuits. The pull-up circuit includes a transistor and a single termination resistor coupled to the transistor, and is simpler than other types of pull-up circuits. This simplicity in design saves area on a chip. The termination resistor in the pull-up circuit can be an n-well resistor formed on the same chip as the transistor, thereby further contributing to the savings in chip area.

Abstract: In a system, such as an open-drain bus architecture system, a termination impedance can be dynamically coupled or de-coupled from a bus. The termination impedance is coupled to the bus by a dynamic control circuit if a signal is being received from the bus or if a binary 1 is driven on the bus. The termination impedance is de-coupled from the bus by the dynamic control circuit if a binary 0 is driven on the bus. Coupling the termination impedance to the bus improves signal quality by providing a matching impedance. De-coupling the termination impedance reduces power dissipation and improves receiver noise margin.