Abstract: A tray is constituted by a tray body portion for connecting a plurality of pockets and cushioning portions which are arranged on the bottom portions of the pockets serving as contact positions between the pockets and CSPs when the CSPs are stored in the pockets and which are formed of a soft material having a degree of hardness lower than that of the tray body portion. The tray moderates impact force acting on the CSPs in falling the tray to prevent the CSP from being broken and damaged.

Abstract: A packaged semiconductor device and an electronic device module having such packaged semiconductor device. The package semiconductor device includes a semiconductor wafer chip, electrode leads, connection conductors for interconnecting the chip and the electrode leads, a heat sink block attached to the semiconductor wafer chip and a mold block. The mold block has a first mold block portion for molding the semiconductor wafer chip, electrode leads, connection conductors and a first portion of the heat sink block relatively nearer to the semiconductor wafer chip and a second molde block portion for molding a second portion of the heat sink block relatively farther from the semiconductor wafer chip. The second mold block portion is smaller than the first mold block portion and extending from the mold block portion so that the mold block has, as whole, has such a shape as having a raised land on its one side projecting in an outward direction.