Patents by Inventor Uta Gebauer
Uta Gebauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7235873Abstract: A protective device for subassemblies having a substrate and at least one component to be protected which is disposed on the substrate includes at least one covering element for covering a subassembly. An expanded filler material fills at least one given space between the substrate and the covering element and provides protection against mechanical compression. A method of producing a protective device is also provided. An expandable material is applied to the substrate and is expanded after the covering element has been mounted.Type: GrantFiled: August 1, 2002Date of Patent: June 26, 2007Assignee: Infineon Technologies AGInventors: Volker Strutz, Uta Gebauer
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Patent number: 6927487Abstract: A protective device is provided for subassemblies having a substrate and a component disposed thereon and needing to be protected. The component typically is a semiconductor component. The protective device includes a covering element, a spacer, and a guide. The covering element covers a subassembly. The spacer is disposed between the covering element and the substrate for maintaining a predefined spacing between the covering element and the component to be protected in the area of the spacer. The guide is used for fixing a free end of the spacer to the covering element and/or to the substrate in a predefined X and/or Y position.Type: GrantFiled: August 1, 2002Date of Patent: August 9, 2005Assignee: Infineon Technologies AGInventors: Uta Gebauer, Volker Strutz
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Patent number: 6903932Abstract: A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be protected, one or more moldings serving for mechanical support, at least one of the moldings being in contact with the substrate and/or a supporting element disposed on the substrate after the covering element has been mounted on the subassembly, and the planar area and the molding being disposed such that, in the event of pressure on the covering element, no displacement of the at least one component (4) to be protected occurs.Type: GrantFiled: August 1, 2002Date of Patent: June 7, 2005Assignee: Infineon Technologies AGInventors: Ingo Wennemuth, Volker Strutz, Uta Gebauer
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Patent number: 6872594Abstract: The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic components of overlying and underlying semiconductor chips are thus connected to one another via the through contacts.Type: GrantFiled: September 16, 2003Date of Patent: March 29, 2005Assignee: Infineon Technologies AGInventors: Uta Gebauer, Ingo Wennemuth
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Patent number: 6851598Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.Type: GrantFiled: July 25, 2002Date of Patent: February 8, 2005Assignee: Infineon Technologies AGInventors: Uta Gebauer, Harry Hedler, Jürgen Högerl, Volker Strutz
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Patent number: 6815613Abstract: The invention relates to an electronic component with external connection elements and to a method of electrically connecting and/or fixing an electronic component to a printed-circuit board. For this purpose, the electronic component has capillary elements as external connection elements, which are connected to contact connection areas of a leadframe or to contact areas of a chip. The capillary element protrudes out of the electronic component and has, on its protruding end, a suction opening with capillary action.Type: GrantFiled: September 13, 2001Date of Patent: November 9, 2004Assignee: Technologies AGInventors: Uta Gebauer, Volker Strutz
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Publication number: 20040063245Abstract: The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic components of overlying and underlying semiconductor chips are thus connected to one another via the through contacts.Type: ApplicationFiled: September 16, 2003Publication date: April 1, 2004Applicant: Infineon Technologies AGInventors: Uta Gebauer, Ingo Wennemuth
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Patent number: 6686648Abstract: The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic components of overlying and underlying semiconductor chips are thus connected to one another via the through contacts.Type: GrantFiled: January 16, 2002Date of Patent: February 3, 2004Assignee: Infineon Technologies AGInventors: Uta Gebauer, Ingo Wennemuth
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Publication number: 20030038157Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.Type: ApplicationFiled: July 25, 2002Publication date: February 27, 2003Inventors: Uta Gebauer, Harry Hedler, Jurgen Hogerl, Volker Strutz
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Publication number: 20030025194Abstract: A protective device is provided for subassemblies having a substrate and a component disposed thereon and needing to be protected. The component typically is a semiconductor component. The protective device includes a covering element, a spacer, and a guide. The covering element covers a subassembly. The spacer is disposed between the covering element and the substrate for maintaining a predefined spacing between the covering element and the component to be protected in the area of the spacer. The guide is used for fixing a free end of the spacer to the covering element and/or to the substrate in a predefined X and/or Y position.Type: ApplicationFiled: August 1, 2002Publication date: February 6, 2003Inventors: Uta Gebauer, Volker Strutz
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Publication number: 20030026077Abstract: A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be protected, one or more moldings serving for mechanical support, at least one of the moldings being in contact with the substrate and/or a supporting element disposed on the substrate after the covering element has been mounted on the subassembly, and the planar area and the molding being disposed such that, in the event of pressure on the covering element, no displacement of the at least one component (4) to be protected occurs.Type: ApplicationFiled: August 1, 2002Publication date: February 6, 2003Inventors: Ingo Wennemuth, Volker Strutz, Uta Gebauer
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Publication number: 20030025187Abstract: A protective device is described for subassemblies having a substrate and components disposed thereon and to be protected, for example semiconductor components. The protective device has at least one covering element for covering a subassembly, and at least one compression prevention element, which is disposed between the at least one covering element and the substrate and which is connected to the substrate and a surface of the covering element which faces the components and the substrate in such a way that a predefined spacing between covering element and the components to be protected can be maintained or is maintained.Type: ApplicationFiled: August 1, 2002Publication date: February 6, 2003Inventors: Volker Strutz, Uta Gebauer, Thorsten Meyer
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Publication number: 20030024735Abstract: A protective device for subassemblies having a substrate and at least one component to be protected which is disposed on the substrate includes at least one covering element for covering a subassembly. An expanded filler material fills at least one given space between the substrate and the covering element and provides protection against mechanical compression. A method of producing a protective device is also provided. An expandable material is applied to the substrate and is expanded after the covering element has been mounted.Type: ApplicationFiled: August 1, 2002Publication date: February 6, 2003Inventors: Volker Strutz, Uta Gebauer
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Configuration with at least two stacked semiconductor chips and method for forming the configuration
Publication number: 20020158344Abstract: A configuration containing stacked semiconductor chips, which have in each case an active front side with semiconductor structures and a passive rear side. Raised locations are provided on the active front side of each semiconductor chip and correspond to depressions on the rear side of a directly adjacent semiconductor chip. The raised locations are adhesively bonded and/or soldered to the corresponding depressions. A method for producing the configuration is also described.Type: ApplicationFiled: April 25, 2002Publication date: October 31, 2002Inventors: Uta Gebauer, Jens Pohl -
Patent number: 6462407Abstract: The invention relates to an electronic device having a multiplicity of contact bumps and an intermediate support. In this case, the intermediate support connects the multiplicity of contact bumps to contact areas of a semiconductor chip via a multiplicity of flat conductors which have contact connecting lugs exposed in a bonding channel window of the intermediate support. The contact areas are configured in the bonding channel window via the bonded contact connecting lugs of the flat conductors. The width of the bonding channel window is increasingly greater with increasing distance from the neutral point of the semiconductor chip.Type: GrantFiled: March 23, 2001Date of Patent: October 8, 2002Assignee: Infineon Technologies AGInventors: Uta Gebauer, Thomas Münch, Friedrich Wanninger
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Publication number: 20020094607Abstract: The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic components of overlying and underlying semiconductor chips are thus connected to one another via the through contacts.Type: ApplicationFiled: January 16, 2002Publication date: July 18, 2002Inventors: Uta Gebauer, Ingo Wennemuth
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Publication number: 20020053467Abstract: The invention relates to an electronic component (1) with external connection elements (2) and to a method of electrically connecting and/or fixing an electronic component (1) and a printed-circuit board (15). For this purpose, the electronic component (1) has capillary elements (6) as external connection elements (2), which are connected to contact connection areas (3) of a leadframe (4) or to contact areas of a chip (5). The capillary element (6) protrudes out of the electronic component (1) and has on its protruding end (7) a suction opening (8) with capillary action.Type: ApplicationFiled: September 13, 2001Publication date: May 9, 2002Inventors: Uta Gebauer, Volker Strutz
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Publication number: 20010048159Abstract: The invention relates to an electronic device having a multiplicity of contact bumps and an intermediate support. In this case, the intermediate support connects the multiplicity of contact bumps to contact areas of a semiconductor chip via a multiplicity of flat conductors which have contact connecting lugs exposed in a bonding channel window of the intermediate support. The contact areas are configured in the bonding channel window via the bonded contact connecting lugs of the flat conductors. The width of the bonding channel window is increasingly greater with increasing distance from the neutral point of the semiconductor chip.Type: ApplicationFiled: March 23, 2001Publication date: December 6, 2001Inventors: Uta Gebauer, Thomas Munch, Friedrich Wanninger