Patents by Inventor Uta Sasse

Uta Sasse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Placement system for populating a substrate with electronic components
    Patent number: 7500305
    Abstract: A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: March 10, 2009
    Assignee: Qimonda AG
    Inventors: Jürgen Högerl, Jens Pohl, Uta Sasse, Ingo Wennemuth
  • Method for populating a substrate with electronic components
    Patent number: 7069647
    Abstract: A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: July 4, 2006
    Assignee: Infineon Technologies AG
    Inventors: Jürgen Högerl, Jens Pohl, Uta Sasse, Ingo Wennemuth
  • Placement system for populating a substrate with electronic components
    Publication number: 20060123624
    Abstract: A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.
    Type: Application
    Filed: February 7, 2006
    Publication date: June 15, 2006
    Inventors: Jurgen Hogerl, Jens Pohl, Uta Sasse, Ingo Wennemuth
  • Method and placement system for populating a substrate with electronic components
    Publication number: 20040111875
    Abstract: A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.
    Type: Application
    Filed: November 3, 2003
    Publication date: June 17, 2004
    Inventors: Jurgen Hogerl, Jens Pohl, Uta Sasse, Ingo Wennemuth