Patents by Inventor Ute Drechsler

Ute Drechsler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11673798
    Abstract: A device includes a first layer of an electrically insulating material and a second layer of a non-electrically insulating material (e.g., semiconductor or electrically conductive) extending on the first layer. The second layer is structured so as to define opposite, lateral walls of a microchannel, a bottom wall of which is defined by an exposed surface of the first layer. The second layer is further structured to form one or more electrical insulation barriers; each barrier includes a line of through holes, each surrounded by an oxidized region of the material of the second layer. The through holes alternate with oxidized portions of the oxidized region along the line. Each barrier extends, as a whole, laterally across the second layer up to one of the lateral walls and delimits two sections of the second layer on each side of the barrier and on a same side of the microchannel.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: June 13, 2023
    Assignee: International Business Machines Corporation
    Inventors: Gabriel Fernando Puebla Hellmann, Diego Monserrat Lopez, Ute Drechsler, Marcel Mayor, Emanuel Marc Löertscher
  • Patent number: 11520228
    Abstract: A method of processing a layer structure with a semiconductor layer to form metasurface structures is disclosed. The method relies on a layer structure that includes a substrate, a layer stack, and resist structures. The latter are made of a resist material that includes a semiconductor element. The layer stack is arranged on top of the substrate. The resist structures form a pattern on the layer stack. The layer stack includes: a semiconductor layer (arranged on top of the substrate); a protective layer (arranged on top of the semiconductor layer); and a transfer layer (arranged on top of the protective layer). The layer structure is obtained by forming the layer stack on top of the substrate, wherein the protective layer is deposited using an atomic-layer deposition process.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: December 6, 2022
    Assignee: International Business Machines Corporation
    Inventors: Ute Drechsler, Emanuel Marc Löertscher
  • Publication number: 20220135399
    Abstract: A device includes a first layer of an electrically insulating material and a second layer of a non-electrically insulating material (e.g., semiconductor or electrically conductive) extending on the first layer. The second layer is structured so as to define opposite, lateral walls of a microchannel, a bottom wall of which is defined by an exposed surface of the first layer. The second layer is further structured to form one or more electrical insulation barriers; each barrier includes a line of through holes, each surrounded by an oxidized region of the material of the second layer. The through holes alternate with oxidized portions of the oxidized region along the line. Each barrier extends, as a whole, laterally across the second layer up to one of the lateral walls and delimits two sections of the second layer on each side of the barrier and on a same side of the microchannel.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 5, 2022
    Inventors: Gabriel Fernando Puebla Hellmann, Diego Monserrat Lopez, Ute Drechsler, Marcel Mayor, Emanuel Marc Löertscher
  • Publication number: 20220066314
    Abstract: A method of processing a layer structure with a semiconductor layer to form metasurface structures is disclosed. The method relies on a layer structure that includes a substrate, a layer stack, and resist structures. The latter are made of a resist material that includes a semiconductor element. The layer stack is arranged on top of the substrate. The resist structures form a pattern on the layer stack. The layer stack includes: a semiconductor layer (arranged on top of the substrate); a protective layer (arranged on top of the semiconductor layer); and a transfer layer (arranged on top of the protective layer). The layer structure is obtained by forming the layer stack on top of the substrate, wherein the protective layer is deposited using an atomic-layer deposition process.
    Type: Application
    Filed: September 3, 2020
    Publication date: March 3, 2022
    Inventors: Ute Drechsler, Emanuel Marc Löertscher
  • Patent number: 10980448
    Abstract: A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: April 20, 2021
    Assignee: International Business Machines Corporation
    Inventors: Neil Ebejer, Ute Drechsler, Patrick Ruch
  • Publication number: 20210106259
    Abstract: A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Inventors: Neil Ebejer, Ute Drechsler, Patrick Ruch
  • Patent number: 10546992
    Abstract: Embodiments are directed to a superconducting microwave circuit. The circuit includes a substrate and two electrodes. The latter form an electrode pair dimensioned so as to support an electromagnetic field, which allows the circuit to be operated in the microwave domain. The substrate exhibits a raised portion, which includes a top surface and two lateral surfaces. The top surface connects the two lateral surfaces, which show respective undercuts (on the lateral sides of the raised portions). Each of the electrodes includes a structure that includes a potentially superconducting material. Two protruding structures are accordingly formed, which are shaped complementarily to the respective undercuts. This way, the shaped structure of each of the electrodes protrudes toward the other one of the electrodes of the pair.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: January 28, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Andreas Fuhrer, Andreas Kuhlmann, Ute Drechsler, Veeresh V. Deshpande, Stefan Filipp, Marc Ganzhorn
  • Publication number: 20200006619
    Abstract: Embodiments are directed to a superconducting microwave circuit. The circuit includes a substrate and two electrodes. The latter form an electrode pair dimensioned so as to support an electromagnetic field, which allows the circuit to be operated in the microwave domain. The substrate exhibits a raised portion, which includes a top surface and two lateral surfaces. The top surface connects the two lateral surfaces, which show respective undercuts (on the lateral sides of the raised portions). Each of the electrodes includes a structure that includes a potentially superconducting material. Two protruding structures are accordingly formed, which are shaped complementarily to the respective undercuts. This way, the shaped structure of each of the electrodes protrudes toward the other one of the electrodes of the pair.
    Type: Application
    Filed: June 28, 2018
    Publication date: January 2, 2020
    Inventors: Andreas FUHRER, Andreas KUHLMANN, Ute DRECHSLER, Veeresh V. DESHPANDE, Stefan FILIPP, Marc GANZHORN
  • Publication number: 20190350500
    Abstract: A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.
    Type: Application
    Filed: May 16, 2018
    Publication date: November 21, 2019
    Inventors: Neil Ebejer, Ute Drechsler, Patrick Ruch
  • Patent number: 9869695
    Abstract: An atomic-force microscope system is provided including: an electrically conducting cantilever support; an electrically insulating element; and an electrically conducting cantilever anchored at a first end to the cantilever support via the insulating element, the cantilever including a probe tip at a second end opposite to the first end and the cantilever support is configured as a backside electrode of the cantilever for backside actuation thereof; a Fabry-Perot interferometer including: a resonator with a first mirror defined on the cantilever; and a second mirror defined on the cantilever support having a first side and a second side configured to allow light injection, opposite to the first side, the latter extending at least partly vis-à-vis the first mirror. The interferometer includes a light-emitting device, and a detector configured for detecting a property of the system impacted by interferences of light emitted by the light-emitting device. Methods of operations are also provided.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: January 16, 2018
    Assignee: International Business Machines Corporation
    Inventors: Ute Drechsler, Urs T Duerig, Armin Knoll, Thilo Stoeferle
  • Patent number: 8963661
    Abstract: A nano-electro-mechanical switch includes an input electrode, a body electrode, an insulating layer, an actuator electrode, an output electrode, and a cantilever beam adapted to flex in response to an actuation voltage applied between the body electrode and the actuator electrode. The cantilever beam includes the input electrode, the body electrode and the insulating layer, the latter separating the body electrode from the input electrode, the cantilever beam being configured such that, upon flexion of the cantilever beam, the input electrode comes in contact with the output electrode at a single mechanical contact point at the level of an end of the cantilever beam.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: February 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Michel Despont, Ute Drechsler, Daniel Grogg, Christoph Hagleitner, Yu Pu
  • Patent number: 8925183
    Abstract: A nano-electro-mechanical switch includes an input electrode, a body electrode, an insulating layer, an actuator electrode, an output electrode, and a cantilever beam adapted to flex in response to an actuation voltage applied between the body electrode and the actuator electrode. The cantilever beam includes the input electrode, the body electrode and the insulating layer, the latter separating the body electrode from the input electrode, the cantilever beam being configured such that, upon flexion of the cantilever beam, the input electrode comes in contact with the output electrode at a single mechanical contact point at the level of an end of the cantilever beam.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: January 6, 2015
    Assignee: International Business Machines Corporation
    Inventors: Michel Despont, Ute Drechsler, Daniel Grogg, Christoph Hagleitner, Yu Pu
  • Patent number: 8847079
    Abstract: An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: September 30, 2014
    Assignee: International Business Machines Corporation
    Inventors: Laurent A. Dellmann, Michel Despont, Ute Drechsler, Roland M. Guerre
  • Patent number: 8695639
    Abstract: A micro fluidic probe head includes a first layer, a second layer, and a first tubing port extending from an upper face of the first layer. The first layer has a first via, enabling fluid communication between the first port and a lower face of the first layer. The second layer includes a first aperture on a face, and a first microchannel enabling fluid communication between an upper face of the second layer, facing the lower face of the first layer, and the first aperture. The head enables fluid communication between the first via and the first microchannel. At least a portion of the first microchannel is a groove open on the upper face of the second layer, closed by a portion of a lower face of a layer of the head. The probe head further comprises a second tubing port, a second via, a second aperture and a second micro channel.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: April 15, 2014
    Assignee: International Business Machines Corporation
    Inventors: Emmanuel Delamarche, Ute Drechsler, Robert Lovchik
  • Patent number: 8695641
    Abstract: A microfluidic probe head includes a first layer, a second layer, and a first tubing port extending from an upper face of the first layer. The first layer has a first via, enabling fluid communication between the first port and a lower face of the first layer. The second layer includes a first aperture on a face, and a first microchannel enabling fluid communication between an upper face of the second layer, facing the lower face of the first layer, and the first aperture. The head enables fluid communication between the first via and the first microchannel. At least a portion of the first microchannel is a groove open on the upper face of the second layer, closed by a portion of a lower face of a layer of the head. The probe head further comprises a second tubing port, a second via, a second aperture and a second microchannel.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: April 15, 2014
    Assignee: International Business Machines Corporation
    Inventors: Emmanuel Delamarche, Ute Drechsler, Robert Lovchik
  • Publication number: 20140059843
    Abstract: A nano-electro-mechanical switch includes an input electrode, a body electrode, an insulating layer, an actuator electrode, an output electrode, and a cantilever beam adapted to flex in response to an actuation voltage applied between the body electrode and the actuator electrode. The cantilever beam includes the input electrode, the body electrode and the insulating layer, the latter separating the body electrode from the input electrode, the cantilever beam being configured such that, upon flexion of the cantilever beam, the input electrode comes in contact with the output electrode at a single mechanical contact point at the level of an end of the cantilever beam.
    Type: Application
    Filed: September 19, 2013
    Publication date: March 6, 2014
    Applicant: International Business Machines Corporation
    Inventors: Michel Despont, Ute Drechsler, Daniel Grogg, Christoph Hagleitner, Yu Pu
  • Publication number: 20140061013
    Abstract: A nano-electro-mechanical switch includes an input electrode, a body electrode, an insulating layer, an actuator electrode, an output electrode, and a cantilever beam adapted to flex in response to an actuation voltage applied between the body electrode and the actuator electrode. The cantilever beam includes the input electrode, the body electrode and the insulating layer, the latter separating the body electrode from the input electrode, the cantilever beam being configured such that, upon flexion of the cantilever beam, the input electrode comes in contact with the output electrode at a single mechanical contact point at the level of an end of the cantilever beam.
    Type: Application
    Filed: August 26, 2013
    Publication date: March 6, 2014
    Applicant: International Business Machines Corporation
    Inventors: Michel Despont, Ute Drechsler, Daniel Grogg, Christoph Hagleitner, Yu Pu
  • Patent number: 8332961
    Abstract: Tips including a platinum silicide at an apex of a single crystal silicon tip are provided herein. Also, techniques for creating a tip are provided. The techniques include depositing an amount of platinum (Pt) on a single crystal silicon tip, annealing the platinum and single crystal silicon tip to form a platinum silicide, and selectively etching the platinum with respect to the formed platinum silicide.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: December 11, 2012
    Assignee: International Business Machines Corporation
    Inventors: Harish Bhaskaran, Michel Despont, Ute Drechsler, Abu Sebastian
  • Publication number: 20120285017
    Abstract: A microfluidic probe head includes a first layer, a second layer, and a first tubing port extending from an upper face of the first layer. The first layer has a first via, enabling fluid communication between the first port and a lower face of the first layer. The second layer includes a first aperture on a face, and a first microchannel enabling fluid communication between an upper face of the second layer, facing the lower face of the first layer, and the first aperture. The head enables fluid communication between the first via and the first microchannel. At least a portion of the first microchannel is a groove open on the upper face of the second layer, closed by a portion of a lower face of a layer of the head. The probe head further comprises a second tubing port, a second via, a second aperture and a second microchannel.
    Type: Application
    Filed: July 30, 2012
    Publication date: November 15, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Emmanuel Delamarche, Ute Drechsler, Robert Lovchik
  • Publication number: 20120222294
    Abstract: An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer.
    Type: Application
    Filed: May 14, 2012
    Publication date: September 6, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Laurent A. Dellmann, Michel Despont, Ute Drechsler, Roland M. Guerre