Patents by Inventor Ute Drechsler
Ute Drechsler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11673798Abstract: A device includes a first layer of an electrically insulating material and a second layer of a non-electrically insulating material (e.g., semiconductor or electrically conductive) extending on the first layer. The second layer is structured so as to define opposite, lateral walls of a microchannel, a bottom wall of which is defined by an exposed surface of the first layer. The second layer is further structured to form one or more electrical insulation barriers; each barrier includes a line of through holes, each surrounded by an oxidized region of the material of the second layer. The through holes alternate with oxidized portions of the oxidized region along the line. Each barrier extends, as a whole, laterally across the second layer up to one of the lateral walls and delimits two sections of the second layer on each side of the barrier and on a same side of the microchannel.Type: GrantFiled: October 29, 2020Date of Patent: June 13, 2023Assignee: International Business Machines CorporationInventors: Gabriel Fernando Puebla Hellmann, Diego Monserrat Lopez, Ute Drechsler, Marcel Mayor, Emanuel Marc Löertscher
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Patent number: 11520228Abstract: A method of processing a layer structure with a semiconductor layer to form metasurface structures is disclosed. The method relies on a layer structure that includes a substrate, a layer stack, and resist structures. The latter are made of a resist material that includes a semiconductor element. The layer stack is arranged on top of the substrate. The resist structures form a pattern on the layer stack. The layer stack includes: a semiconductor layer (arranged on top of the substrate); a protective layer (arranged on top of the semiconductor layer); and a transfer layer (arranged on top of the protective layer). The layer structure is obtained by forming the layer stack on top of the substrate, wherein the protective layer is deposited using an atomic-layer deposition process.Type: GrantFiled: September 3, 2020Date of Patent: December 6, 2022Assignee: International Business Machines CorporationInventors: Ute Drechsler, Emanuel Marc Löertscher
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Publication number: 20220135399Abstract: A device includes a first layer of an electrically insulating material and a second layer of a non-electrically insulating material (e.g., semiconductor or electrically conductive) extending on the first layer. The second layer is structured so as to define opposite, lateral walls of a microchannel, a bottom wall of which is defined by an exposed surface of the first layer. The second layer is further structured to form one or more electrical insulation barriers; each barrier includes a line of through holes, each surrounded by an oxidized region of the material of the second layer. The through holes alternate with oxidized portions of the oxidized region along the line. Each barrier extends, as a whole, laterally across the second layer up to one of the lateral walls and delimits two sections of the second layer on each side of the barrier and on a same side of the microchannel.Type: ApplicationFiled: October 29, 2020Publication date: May 5, 2022Inventors: Gabriel Fernando Puebla Hellmann, Diego Monserrat Lopez, Ute Drechsler, Marcel Mayor, Emanuel Marc Löertscher
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Publication number: 20220066314Abstract: A method of processing a layer structure with a semiconductor layer to form metasurface structures is disclosed. The method relies on a layer structure that includes a substrate, a layer stack, and resist structures. The latter are made of a resist material that includes a semiconductor element. The layer stack is arranged on top of the substrate. The resist structures form a pattern on the layer stack. The layer stack includes: a semiconductor layer (arranged on top of the substrate); a protective layer (arranged on top of the semiconductor layer); and a transfer layer (arranged on top of the protective layer). The layer structure is obtained by forming the layer stack on top of the substrate, wherein the protective layer is deposited using an atomic-layer deposition process.Type: ApplicationFiled: September 3, 2020Publication date: March 3, 2022Inventors: Ute Drechsler, Emanuel Marc Löertscher
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Patent number: 10980448Abstract: A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.Type: GrantFiled: May 16, 2018Date of Patent: April 20, 2021Assignee: International Business Machines CorporationInventors: Neil Ebejer, Ute Drechsler, Patrick Ruch
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Publication number: 20210106259Abstract: A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.Type: ApplicationFiled: December 23, 2020Publication date: April 15, 2021Inventors: Neil Ebejer, Ute Drechsler, Patrick Ruch
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Patent number: 10546992Abstract: Embodiments are directed to a superconducting microwave circuit. The circuit includes a substrate and two electrodes. The latter form an electrode pair dimensioned so as to support an electromagnetic field, which allows the circuit to be operated in the microwave domain. The substrate exhibits a raised portion, which includes a top surface and two lateral surfaces. The top surface connects the two lateral surfaces, which show respective undercuts (on the lateral sides of the raised portions). Each of the electrodes includes a structure that includes a potentially superconducting material. Two protruding structures are accordingly formed, which are shaped complementarily to the respective undercuts. This way, the shaped structure of each of the electrodes protrudes toward the other one of the electrodes of the pair.Type: GrantFiled: June 28, 2018Date of Patent: January 28, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Andreas Fuhrer, Andreas Kuhlmann, Ute Drechsler, Veeresh V. Deshpande, Stefan Filipp, Marc Ganzhorn
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Publication number: 20200006619Abstract: Embodiments are directed to a superconducting microwave circuit. The circuit includes a substrate and two electrodes. The latter form an electrode pair dimensioned so as to support an electromagnetic field, which allows the circuit to be operated in the microwave domain. The substrate exhibits a raised portion, which includes a top surface and two lateral surfaces. The top surface connects the two lateral surfaces, which show respective undercuts (on the lateral sides of the raised portions). Each of the electrodes includes a structure that includes a potentially superconducting material. Two protruding structures are accordingly formed, which are shaped complementarily to the respective undercuts. This way, the shaped structure of each of the electrodes protrudes toward the other one of the electrodes of the pair.Type: ApplicationFiled: June 28, 2018Publication date: January 2, 2020Inventors: Andreas FUHRER, Andreas KUHLMANN, Ute DRECHSLER, Veeresh V. DESHPANDE, Stefan FILIPP, Marc GANZHORN
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Publication number: 20190350500Abstract: A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.Type: ApplicationFiled: May 16, 2018Publication date: November 21, 2019Inventors: Neil Ebejer, Ute Drechsler, Patrick Ruch
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Patent number: 9869695Abstract: An atomic-force microscope system is provided including: an electrically conducting cantilever support; an electrically insulating element; and an electrically conducting cantilever anchored at a first end to the cantilever support via the insulating element, the cantilever including a probe tip at a second end opposite to the first end and the cantilever support is configured as a backside electrode of the cantilever for backside actuation thereof; a Fabry-Perot interferometer including: a resonator with a first mirror defined on the cantilever; and a second mirror defined on the cantilever support having a first side and a second side configured to allow light injection, opposite to the first side, the latter extending at least partly vis-à-vis the first mirror. The interferometer includes a light-emitting device, and a detector configured for detecting a property of the system impacted by interferences of light emitted by the light-emitting device. Methods of operations are also provided.Type: GrantFiled: August 26, 2016Date of Patent: January 16, 2018Assignee: International Business Machines CorporationInventors: Ute Drechsler, Urs T Duerig, Armin Knoll, Thilo Stoeferle
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Patent number: 8963661Abstract: A nano-electro-mechanical switch includes an input electrode, a body electrode, an insulating layer, an actuator electrode, an output electrode, and a cantilever beam adapted to flex in response to an actuation voltage applied between the body electrode and the actuator electrode. The cantilever beam includes the input electrode, the body electrode and the insulating layer, the latter separating the body electrode from the input electrode, the cantilever beam being configured such that, upon flexion of the cantilever beam, the input electrode comes in contact with the output electrode at a single mechanical contact point at the level of an end of the cantilever beam.Type: GrantFiled: August 26, 2013Date of Patent: February 24, 2015Assignee: International Business Machines CorporationInventors: Michel Despont, Ute Drechsler, Daniel Grogg, Christoph Hagleitner, Yu Pu
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Patent number: 8925183Abstract: A nano-electro-mechanical switch includes an input electrode, a body electrode, an insulating layer, an actuator electrode, an output electrode, and a cantilever beam adapted to flex in response to an actuation voltage applied between the body electrode and the actuator electrode. The cantilever beam includes the input electrode, the body electrode and the insulating layer, the latter separating the body electrode from the input electrode, the cantilever beam being configured such that, upon flexion of the cantilever beam, the input electrode comes in contact with the output electrode at a single mechanical contact point at the level of an end of the cantilever beam.Type: GrantFiled: September 19, 2013Date of Patent: January 6, 2015Assignee: International Business Machines CorporationInventors: Michel Despont, Ute Drechsler, Daniel Grogg, Christoph Hagleitner, Yu Pu
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Patent number: 8847079Abstract: An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer.Type: GrantFiled: May 14, 2012Date of Patent: September 30, 2014Assignee: International Business Machines CorporationInventors: Laurent A. Dellmann, Michel Despont, Ute Drechsler, Roland M. Guerre
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Patent number: 8695639Abstract: A micro fluidic probe head includes a first layer, a second layer, and a first tubing port extending from an upper face of the first layer. The first layer has a first via, enabling fluid communication between the first port and a lower face of the first layer. The second layer includes a first aperture on a face, and a first microchannel enabling fluid communication between an upper face of the second layer, facing the lower face of the first layer, and the first aperture. The head enables fluid communication between the first via and the first microchannel. At least a portion of the first microchannel is a groove open on the upper face of the second layer, closed by a portion of a lower face of a layer of the head. The probe head further comprises a second tubing port, a second via, a second aperture and a second micro channel.Type: GrantFiled: May 7, 2010Date of Patent: April 15, 2014Assignee: International Business Machines CorporationInventors: Emmanuel Delamarche, Ute Drechsler, Robert Lovchik
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Patent number: 8695641Abstract: A microfluidic probe head includes a first layer, a second layer, and a first tubing port extending from an upper face of the first layer. The first layer has a first via, enabling fluid communication between the first port and a lower face of the first layer. The second layer includes a first aperture on a face, and a first microchannel enabling fluid communication between an upper face of the second layer, facing the lower face of the first layer, and the first aperture. The head enables fluid communication between the first via and the first microchannel. At least a portion of the first microchannel is a groove open on the upper face of the second layer, closed by a portion of a lower face of a layer of the head. The probe head further comprises a second tubing port, a second via, a second aperture and a second microchannel.Type: GrantFiled: July 30, 2012Date of Patent: April 15, 2014Assignee: International Business Machines CorporationInventors: Emmanuel Delamarche, Ute Drechsler, Robert Lovchik
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Publication number: 20140059843Abstract: A nano-electro-mechanical switch includes an input electrode, a body electrode, an insulating layer, an actuator electrode, an output electrode, and a cantilever beam adapted to flex in response to an actuation voltage applied between the body electrode and the actuator electrode. The cantilever beam includes the input electrode, the body electrode and the insulating layer, the latter separating the body electrode from the input electrode, the cantilever beam being configured such that, upon flexion of the cantilever beam, the input electrode comes in contact with the output electrode at a single mechanical contact point at the level of an end of the cantilever beam.Type: ApplicationFiled: September 19, 2013Publication date: March 6, 2014Applicant: International Business Machines CorporationInventors: Michel Despont, Ute Drechsler, Daniel Grogg, Christoph Hagleitner, Yu Pu
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Publication number: 20140061013Abstract: A nano-electro-mechanical switch includes an input electrode, a body electrode, an insulating layer, an actuator electrode, an output electrode, and a cantilever beam adapted to flex in response to an actuation voltage applied between the body electrode and the actuator electrode. The cantilever beam includes the input electrode, the body electrode and the insulating layer, the latter separating the body electrode from the input electrode, the cantilever beam being configured such that, upon flexion of the cantilever beam, the input electrode comes in contact with the output electrode at a single mechanical contact point at the level of an end of the cantilever beam.Type: ApplicationFiled: August 26, 2013Publication date: March 6, 2014Applicant: International Business Machines CorporationInventors: Michel Despont, Ute Drechsler, Daniel Grogg, Christoph Hagleitner, Yu Pu
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Patent number: 8332961Abstract: Tips including a platinum silicide at an apex of a single crystal silicon tip are provided herein. Also, techniques for creating a tip are provided. The techniques include depositing an amount of platinum (Pt) on a single crystal silicon tip, annealing the platinum and single crystal silicon tip to form a platinum silicide, and selectively etching the platinum with respect to the formed platinum silicide.Type: GrantFiled: September 22, 2008Date of Patent: December 11, 2012Assignee: International Business Machines CorporationInventors: Harish Bhaskaran, Michel Despont, Ute Drechsler, Abu Sebastian
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Publication number: 20120285017Abstract: A microfluidic probe head includes a first layer, a second layer, and a first tubing port extending from an upper face of the first layer. The first layer has a first via, enabling fluid communication between the first port and a lower face of the first layer. The second layer includes a first aperture on a face, and a first microchannel enabling fluid communication between an upper face of the second layer, facing the lower face of the first layer, and the first aperture. The head enables fluid communication between the first via and the first microchannel. At least a portion of the first microchannel is a groove open on the upper face of the second layer, closed by a portion of a lower face of a layer of the head. The probe head further comprises a second tubing port, a second via, a second aperture and a second microchannel.Type: ApplicationFiled: July 30, 2012Publication date: November 15, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Emmanuel Delamarche, Ute Drechsler, Robert Lovchik
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Publication number: 20120222294Abstract: An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer.Type: ApplicationFiled: May 14, 2012Publication date: September 6, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Laurent A. Dellmann, Michel Despont, Ute Drechsler, Roland M. Guerre