Patents by Inventor Ute Ellringmann

Ute Ellringmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10507997
    Abstract: Dispensers, systems and methods dispense strips of a first adhesive tape which have adhesive on both sides and on one side is covered with a liner. A first storage unit from which the first adhesive tape is drawn off is provided, and a second storage unit from which a second adhesive tape is drawn off is provided. A connection installation by means of which the first adhesive tape and the second adhesive tape are interconnected so as to form a two-ply adhesive tape is provided, and an application installation by means of which the two-ply adhesive tape as a composite is capable of being applied to a substrate is provided.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: December 17, 2019
    Assignee: TESA SE
    Inventors: Peter Himmelsbach, Ute Ellringmann
  • Publication number: 20190161653
    Abstract: A heat-sealable adhesive tape is provided that includes: a hot-melt adhesive layer; and a pressure-sensitive adhesive layer adjacent to the hot-melt adhesive layer, the pressure-sensitive adhesive layer comprising a blend of: b1) at least one poly(meth)acrylate, and b2) at least one selected from an elastomeric material and a thermoplastic-elastomeric material.
    Type: Application
    Filed: November 28, 2017
    Publication date: May 30, 2019
    Inventors: Ute Ellringmann, Martin Geelink, Robert Oliver
  • Publication number: 20190039849
    Abstract: Dispensers, systems and methods dispense strips of a first adhesive tape which have adhesive on both sides and on one side is covered with a liner. A first storage unit from which the first adhesive tape is drawn off is provided, and a second storage unit from which a second adhesive tape is drawn off is provided. A connection installation by means of which the first adhesive tape and the second adhesive tape are interconnected so as to form a two-ply adhesive tape is provided, and an application installation by means of which the two-ply adhesive tape as a composite is capable of being applied to a substrate is provided.
    Type: Application
    Filed: January 17, 2017
    Publication date: February 7, 2019
    Applicant: TESA SE
    Inventors: Peter HIMMELSBACH, Ute ELLRINGMANN
  • Publication number: 20180265742
    Abstract: The present invention relates to a method for producing a flexible adhesive tape for structural bonding, more particularly for clearance compensation, of diverse materials, such as metal, wood, glass and/or plastic, for example.
    Type: Application
    Filed: August 29, 2016
    Publication date: September 20, 2018
    Applicant: TESA SE
    Inventors: Ute ELLRINGMANN, Uwe SCHÜMANN, Björn ZEYSING, Marco BALBO-BLOCK
  • Publication number: 20170260424
    Abstract: A double-sided adhesive tape having a heat-activatable adhesive layer protected with an interliner, in order to allow such tapes to be guided stably over cutting and winding units and also to be stably stored and transported, has a composite system comprising: an adhesive tape (A) comprising: a pressure sensitive adhesive layer, and a heat-activatable adhesive layer; a release liner situated on the pressure sensitive adhesive layer of the tape (A); and an adhesive tape (B) comprising: a carrier layer, a release layer on one side of the carrier layer, and a pressure sensitive adhesive layer on the side of the carrier layer opposite the release layer and in direct contact with the heat-activatable adhesive layer of tape (A). Also disclosed is a method for producing a composite system of this kind, and the specific use of the tape (B).
    Type: Application
    Filed: February 27, 2017
    Publication date: September 14, 2017
    Applicant: TESA SE
    Inventors: UTE ELLRINGMANN, MARTIN GEELINK, JIAN YANG-VOSS
  • Patent number: 9560697
    Abstract: A double-sidedly self-adhesive planar element which is intrinsically heatable in a self-regulating way and at the same time has a particularly high flexibility. The planar element has a layer sequence of a posistor heating layer, a contacting layer and an adhesive layer, the contacting layer being a two-dimensional perforate contacting element which within the planar element is therefore present as a contacting element which has not been applied to a backing. Also disclosed is an adhesively bonded assembly of a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and a method of using a planar element of the aforesaid kind for heating an adhesively bonded assembly.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: January 31, 2017
    Assignee: TESA SE
    Inventors: Monika Junghans, Bernd Dietz, Frank Domann, Udo Dominikat, Klaus Keite-Telgenbüscher, Ute Ellringmann
  • Patent number: 8383997
    Abstract: A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on one side only, and is therefore particularly easy to handle, and that, on bonding, the adhesive passes through cutouts in the contacting layer, and the planar element thus becomes double-sidedly bondable. The invention further provides a method for the bonding of this planar element, including as a key step the passage of the adhesive through the cutouts in the contacting layer, thus turning a single-sidedly adhesive planar element into a double-sidedly adhesive planar element.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: February 26, 2013
    Assignee: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Monika Junghans, Bernd Dietz, Udo Dominikat, Frank Domann, Ute Ellringmann
  • Patent number: 8283612
    Abstract: The invention provides a planar element which is intrinsically heatable and which is particularly suitable for attachment to multi-dimensionally curved surfaces. For this purpose the planar element features particularly high deformability, achieved in accordance with the invention through a planar element having a layer sequence comprising a heating layer and a contacting layer, each of these two layers being composed of a polymeric material based on elastomers and/or on plastic polymers which have a particular elongation at break and at the same time a particular tensile elasticity modulus. Furthermore, the invention provides an adhesively bonded assembly comprising a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and the use of such a planar element for heating an adhesively bonded assembly.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: October 9, 2012
    Assignee: Tesa SE
    Inventors: Klaus Keite-Telgenbuescher, Monika Junghans, Bernd Dietz, Udo Dominikat, Frank Domann, Ute Ellringmann, Veronika Ramm
  • Publication number: 20100213189
    Abstract: The invention provides a planar element which is intrinsically heatable and which is particularly suitable for attachment to multi-dimensionally curved surfaces. For this purpose the planar element features particularly high deformability, achieved in accordance with the invention through a planar element having a layer sequence comprising a heating layer and a contacting layer, each of these two layers being composed of a polymeric material based on elastomers and/or on plastic polymers which have a particular elongation at break and at the same time a particular tensile elasticity modulus. Furthermore, the invention provides an adhesively bonded assembly comprising a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and the use of such a planar element for heating an adhesively bonded assembly.
    Type: Application
    Filed: February 25, 2010
    Publication date: August 26, 2010
    Applicant: TESA SE
    Inventors: Klaus Keite-Telgenbuescher, Monika Junghans, Bernd Deitz, Udo Dominikat, Frank Domann, Ute Ellringmann, Veronika Ramm
  • Publication number: 20100170889
    Abstract: A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on one side only, and is therefore particularly easy to handle, and that, on bonding, the adhesive passes through cutouts in the contacting layer, and the planar element thus becomes double-sidedly bondable. The invention further provides a method for the bonding of this planar element, including as a key step the passage of the adhesive through the cutouts in the contacting layer, thus turning a single-sidedly adhesive planar element into a double-sidedly adhesive planar element.
    Type: Application
    Filed: December 17, 2009
    Publication date: July 8, 2010
    Applicant: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Monika Junghans, Bernd Dietz, Udo Dominikat, Frank Domann, Ute Ellringmann
  • Publication number: 20100021683
    Abstract: A double-sidedly self-adhesive planar element which is intrinsically heatable in a self-regulating way and at the same time has a particularly high flexibility. The planar element has a layer sequence of a posistor heating layer, a contacting layer and an adhesive layer, the contacting layer being a two-dimensional perforate contacting element which within the planar element is therefore present as a contacting element which has not been applied to a backing. Also disclosed is an adhesively bonded assembly of a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and a method of using a planar element of the aforesaid kind for heating an adhesively bonded assembly.
    Type: Application
    Filed: July 22, 2009
    Publication date: January 28, 2010
    Applicant: tesa SE
    Inventors: Monika Junghans, Bernd Dietz, Frank Domann, Udo Dominikat, Klaus Keite-Telgenbüscher, Ute Ellringmann