Patents by Inventor Ute STEINHAEUSSER

Ute STEINHAEUSSER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Corrosion resistant pad for enhanced thin film acoustic packaging (TFAP)
    Patent number: 11967938
    Abstract: An apparatus and method for making an acoustic filter package where the apparatus includes a base layer; a support layer disposed on the base layer; a piezoelectric structure disposed on the support layer; wherein the piezoelectric structure comprises: a piezoelectric layer; a top electrode on a top surface of the piezoelectric layer; a bottom electrode on a bottom surface of the piezoelectric layer; a contact pad coupled to the bottom electrode that extends through an opening in the piezoelectric layer and is coupled to the bottom electrode or the top electrode; and a corrosion resistant pad disposed on the contact pad; and a capping structure disposed on the piezoelectric structure.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: April 23, 2024
    Assignee: RF360 SINGAPORE PTE. LTD.
    Inventors: Robert Felix Bywalez, Ute Steinhaeusser
  • Variation of metal layer stack under under bump metallization (UBM)
    Patent number: 11894829
    Abstract: In certain aspects, a chip includes a pad, and a first passivation layer, wherein a first portion of the first passivation layer extends over a first portion of the pad. The chip also includes a first metal layer between the first portion of the pad and the first portion of the first passivation layer. The chip further includes an under bump metallization (UBM) electrically coupled to a second portion of the pad.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: February 6, 2024
    Assignee: RF360 Singapore Pte. Ltd.
    Inventors: Ute Steinhaeusser, Niklaas Konopka, Alexander Landel
  • CORROSION RESISTANT PAD FOR ENHANCED THIN FILM ACOUSTIC PACKAGING (TFAP)
    Publication number: 20220321077
    Abstract: An apparatus and method for making an acoustic filter package where the apparatus includes a base layer; a support layer disposed on the base layer; a piezoelectric structure disposed on the support layer; wherein the piezoelectric structure comprises: a piezoelectric layer; a top electrode on a top surface of the piezoelectric layer; a bottom electrode on a bottom surface of the piezoelectric layer; a contact pad coupled to the bottom electrode that extends through an opening in the piezoelectric layer and is coupled to the bottom electrode or the top electrode; and a corrosion resistant pad disposed on the contact pad; and a capping structure disposed on the piezoelectric structure.
    Type: Application
    Filed: April 6, 2021
    Publication date: October 6, 2022
    Inventors: Robert Felix BYWALEZ, Ute STEINHAEUSSER
  • ELECTRIC COMPONENT WITH PAD FOR A BUMP AND MANUFACTURING METHOD THEREOF
    Publication number: 20220246546
    Abstract: A bump pad enclosure providing an improved reliability of a bump connection is provided. The bump pad enclosure comprises an electrode pad, a UBM and a first shield. The first shield covers at least a first perimeter area of the electrode pad. The first shield is provided and configured to shield the first perimeter area from a detrimental influence of the environment.
    Type: Application
    Filed: June 9, 2020
    Publication date: August 4, 2022
    Inventors: Robert Felix BYWALEZ, Ute STEINHAEUSSER, Monika SCHMIEDGEN
  • VARIATION OF METAL LAYER STACK UNDER UNDER BUMP METALLIZATION (UBM)
    Publication number: 20210143790
    Abstract: In certain aspects, a chip includes a pad, and a first passivation layer, wherein a first portion of the first passivation layer extends over a first portion of the pad. The chip also includes a first metal layer between the first portion of the pad and the first portion of the first passivation layer. The chip further includes an under bump metallization (UBM) electrically coupled to a second portion of the pad.
    Type: Application
    Filed: April 21, 2020
    Publication date: May 13, 2021
    Inventors: Ute STEINHAEUSSER, Niklaas KONOPKA, Alexander LANDEL