Abstract: Sintering apparatus, having an electrically conductive die with a receiving space provided for receiving a sintering material to be sintered, a first adjusting device and a mold punch adjustably moved by the first adjusting device into a pressing position, in which, for the purpose of the mechanical pressurization of the sintering material with a first compressive force, the at mold punch is dipped axially into the receiving space. A resistance heating device is configured to heat the die by applying an electric current to the die. Assigned to the resistance heating device are a second adjusting device and a contact punch be adjustably moved by the second adjusting device into a contact position, in which, for applying an electric current to the die, the contact punch is pressed against an outer surface of the die with a second compressive force.