Patents by Inventor Utkarsha Avinash Dhanwate

Utkarsha Avinash Dhanwate has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for predicting film thickness of individual layers using virtual metrology
    Patent number: 11862520
    Abstract: A method includes obtaining sensor data associated with a deposition process performed in a process chamber to deposit a film stack on a surface of a substrate, wherein the film stack comprises a plurality of layers of a first material and a plurality of layers of a second material. The method further includes obtaining metrology data associated with the film stack. The method further includes training a first machine-learning model based on the sensor data and the metrology data, wherein the first machine-learning model is trained to generate predictive metrology data associated with layers of the first material. The method further includes training a second machine-learning model based on the sensor data and the metrology data, wherein the second machine-learning model is trained to generate predictive metrology data associated with layers of the second material.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: January 2, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Bharath Ram Sundar, Raman K. Nurani, Utkarsha Avinash Dhanwate, Ramakrishnan S. Hariharan, Suresh Bharatharajan Kudallur, Vishwath Ram Amarnath
  • SYSTEMS AND METHODS FOR PREDICTING FILM THICKNESS OF INDIVIDUAL LAYERS USING VIRTUAL METROLOGY
    Publication number: 20220246481
    Abstract: A method includes obtaining sensor data associated with a deposition process performed in a process chamber to deposit a film stack on a surface of a substrate, wherein the film stack comprises a plurality of layers of a first material and a plurality of layers of a second material. The method further includes obtaining metrology data associated with the film stack. The method further includes training a first machine-learning model based on the sensor data and the metrology data, wherein the first machine-learning model is trained to generate predictive metrology data associated with layers of the first material. The method further includes training a second machine-learning model based on the sensor data and the metrology data, wherein the second machine-learning model is trained to generate predictive metrology data associated with layers of the second material.
    Type: Application
    Filed: February 3, 2021
    Publication date: August 4, 2022
    Inventors: Bharath Ram Sundar, Raman K. Nurani, Utkarsha Avinash Dhanwate, Ramakrishnan S. Hariharan, Suresh Bharatharajan Kudallur, Vishwath Ram Amarnath