Patents by Inventor Utpal Chakrabarti
Utpal Chakrabarti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10735101Abstract: A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.Type: GrantFiled: July 31, 2017Date of Patent: August 4, 2020Assignee: Cisco Technology, Inc.Inventors: Stefan Pfnuer, Ravi Kachru, John Fangman, Utpal Chakrabarti
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Publication number: 20170331557Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.Type: ApplicationFiled: July 31, 2017Publication date: November 16, 2017Inventors: Stefan Pfnuer, Ravi Kachru, John Fangman, Utpal Chakrabarti
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Patent number: 9755752Abstract: A method of manufacturing an optical communication device aligns an optical sub-assembly and an optical modulator on a carrier wafer. A first sub-mount supports the optical sub-assembly and a second sub-mount supports the optical modulator. Pre-defined break lines are placed on the carrier wafer to accommodate separation of the sub-assembly and the optical modulator. The first sub-mount connects the optical sub-assembly to a thermoelectric cooler by either an epoxy, a spacer layer, or both. The optical sub-assembly is aligned in the x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer.Type: GrantFiled: January 13, 2014Date of Patent: September 5, 2017Assignee: Cisco Technology, Inc.Inventors: Stefan Pfnuer, Ravi Kachru, John Fangman, Utpal Chakrabarti
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Patent number: 9235019Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.Type: GrantFiled: September 26, 2014Date of Patent: January 12, 2016Assignee: Cisco Technology, Inc.Inventors: Kalpendu Shastri, Soham Pathak, Utpal Chakrabarti, Vipulkumar Patel, Bipin Dama, Ravinder Kachru, Kishor Desai
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Publication number: 20150121683Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.Type: ApplicationFiled: January 13, 2014Publication date: May 7, 2015Inventors: Stefan Pfnuer, Ravi Kachru, John Fangman, Utpal Chakrabarti
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Publication number: 20150016784Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.Type: ApplicationFiled: September 26, 2014Publication date: January 15, 2015Inventors: Kalpendu SHASTRI, Soham PATHAK, Utpal CHAKRABARTI, Vipulkumar PATEL, Bipin DAMA, Ravinder KACHRU, Kishor DESAI
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Patent number: 8876410Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.Type: GrantFiled: January 9, 2013Date of Patent: November 4, 2014Assignee: Cisco Technology, Inc.Inventors: Kalpendu Shastri, Soham Pathak, Utpal Chakrabarti, Vipulkumar Patel, Bipin Dama, Ravinder Kachru, Kishor Desai
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Publication number: 20130188970Abstract: An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle ?, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure's transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle ? as the enclosure's turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.Type: ApplicationFiled: January 19, 2013Publication date: July 25, 2013Inventors: Kalpendu Shastri, Vipulkumar Patel, Soham Pathak, Utpal Chakrabarti, Bipin Dama, Ravinder Kachru, Kishor Desai
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Publication number: 20130183008Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.Type: ApplicationFiled: January 9, 2013Publication date: July 18, 2013Inventors: Kalpendu Shastri, Soham Pathak, Utpal Chakrabarti, Vipulkumar Patel, Bipin Dama, Ravinder Kachru, Kishor Desai
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Patent number: 8268663Abstract: In a method of annealing a Cd1-xZnxTe sample/wafer, surface contamination is removed from the sample/wafer and the sample/wafer is then introduced into a chamber. The chamber is evacuated and Hydrogen or Deuterium gas is introduced into the evacuated chamber. The sample/wafer is heated to a suitable annealing temperature in the presence of the Hydrogen or Deuterium gas for a predetermined period of time.Type: GrantFiled: June 2, 2009Date of Patent: September 18, 2012Assignee: II-VI IncorporatedInventors: Csaba Szeles, Michael Prokesch, Utpal Chakrabarti
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Publication number: 20110136287Abstract: In a method of annealing a Cd1?xZnxTe sample/wafer, surface contamination is removed from the sample/wafer and the sample/wafer is then introduced into a chamber. The chamber is evacuated and Hydrogen or Deuterium gas is introduced into the evacuated chamber. The sample/wafer is heated to a suitable annealing temperature in the presence of the Hydrogen or Deuterium gas for a predetermined period of time.Type: ApplicationFiled: June 2, 2009Publication date: June 9, 2011Applicant: II-VI INCORPORATEDInventors: Csaba Szeles, Michael Prokesch, Utpal Chakrabarti