Patents by Inventor Utpal R. Vaidya

Utpal R. Vaidya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170228632
    Abstract: Systems and methods wherein one or more processing operations on an identification document occur after a radiation curable material is applied to a surface of the identification document but before the radiation curable material is fully cured. The one or more processing operations can occur before any curing of the radiation curable material takes place. Alternatively, the one or more processing operations can occur after the radiation curable material has been partially cured, and before the radiation curable material is fully or completely cured.
    Type: Application
    Filed: February 3, 2017
    Publication date: August 10, 2017
    Inventors: Roman Thomas KNIPP, Pauline UKPABI, Utpal R. VAIDYA, Thomas J. WAGENER, Brian BEECH
  • Patent number: 6187129
    Abstract: A cutable topcoat composition and apparatus useful for preparing stable data carrying devices, such as multi-layered laminates, and methods for preparing and using the composition. The composition includes a polymerizable composition and a polymeric binder. The polymerizable composition includes hard and flexible polymerizable subunits in a ratio that optimizes flexibility while retaining good adhesion and plasticizer resistance. In a preferred embodiment, a polymerization initiator is also included in the composition. Optionally, a chain transfer agent may also be added to the composition. The composition is substantially plasticizer free. The methods of using the composition include incorporating the composition into a topcoat film useful for storing the topcoat composition prior to use in preparing data-carrying devices, such as cards.
    Type: Grant
    Filed: August 11, 1999
    Date of Patent: February 13, 2001
    Assignee: DataCard Corporation
    Inventors: Utpal R. Vaidya, Felix P. Shvartsman, Robert Sells, Bryan L. Baab
  • Patent number: 6001893
    Abstract: A curable topcoat composition and apparatus useful for preparing stable data carrying devices, such as multi-layered laminates, and methods for preparing and using the composition. The composition includes a polymerizable composition and a polymeric binder. The polymerizable composition includes hard and flexible polymerizable subunits in a ratio that optimizes flexibility while retaining good adhesion and plasticizer resistance. In a preferred embodiment, a polymerization initiator is also included in the composition. Optionally, a chain transfer agent may also be added to the composition. The composition is substantially plasticizer free. The methods of using the composition include incorporating the composition into a topcoat film useful for storing the topcoat composition prior to use in preparing data carrying devices, such as cards.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: December 14, 1999
    Assignee: DataCard Corporation
    Inventors: Utpal R. Vaidya, Felix P. Shvartsman, Robert Sells, Bryan L. Baab
  • Patent number: 5446078
    Abstract: A biodegradable interpolymer and composition is prepared by the reactive blending of a synthetic polymer having functional groups with a naturally occurring biodegradable polymer such as a carbohydrate or protein compound. During reactive blending, the synthetic polymer can undergo a chemical reaction with the biodegradable natural polymer which results in covalent and physical bonding between the two polymers, thereby forming an interpolymer. By this process, a biodegradable interpolymer composition is produced that is suitable for molding various articles.
    Type: Grant
    Filed: March 8, 1994
    Date of Patent: August 29, 1995
    Assignee: Regents of the University of Minnesota
    Inventors: Utpal R. Vaidya, Mrinal Bhattacharya
  • Patent number: 5321064
    Abstract: A biodegradable interpolymer and composition is prepared by the reactive blending of a synthetic polymer having functional groups with a naturally occurring biodegradable polymer such as a carbohydrate or protein compound. During reactive blending, the synthetic polymer can undergo a chemical reaction with the biodegradable natural polymer which results in covalent and physical bonding between the two polymers, thereby forming an interpolymer. By this process, a biodegradable interpolymer composition is produced that is suitable for molding various articles.
    Type: Grant
    Filed: May 12, 1992
    Date of Patent: June 14, 1994
    Assignee: Regents of the University of Minnesota
    Inventors: Utpal R. Vaidya, Mrinal Bhattacharya