Abstract: Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still In still other example embodiments of the present invention, there may be a tin-bismuth (Sn—Bi) family alloy solder between a semiconductor chip and a substrate, and a semiconductor device using the alloy solder. The semiconductor device may include a semiconductor chip formed with a plurality of gold bumps, a substrate having metal wirings connected to the gold bumps, and a junction including a tin-bismuth family alloy solder interposed between and connecting the gold bump and the metal wiring.

Abstract: Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still other example embodiments of the present invention, there may be a tin-bismuth (Sn—Bi) family alloy solder between a semiconductor chip and a substrate, and a semiconductor device using the alloy solder. The semiconductor device may include a semiconductor chip formed with a plurality of gold (Au) bumps, a substrate having metal wirings connected to the gold (Au) bumps, and a junction including a tin-bismuth (Sn—Bi) family alloy solder interposed between and connecting the gold (Au) bump and the metal wiring.