Patents by Inventor Uwe BOG

Uwe BOG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing an electrically conductive connection on a substrate, microelectronic device and method for the production thereof
    Patent number: 11855037
    Abstract: The invention relates to a method (110) for producing an electrically conductive connection (112, 112?) on a substrate (114), comprising the following steps: a) providing a substrate (114), wherein the substrate (114) is configured for receiving an electrically conductive connection (112, 112?); b) providing a reservoir of an electrically conductive liquid alloy, wherein the reservoir has a surface at which the alloy has an insulating layer; c) providing a capillary (120) configured for taking up the electrically conductive liquid alloy; d) penetrating of a tip (122) of the capillary (120) under the surface of the reservoir and taking up of a portion of the alloy from the reservoir; and e) applying the portion of the alloy at least partly to the substrate (114) in such a manner that an electrically conductive connection (112, 112?) is formed from the alloy on the substrate (114), wherein the alloy remains on the substrate (114) by adhesion.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: December 26, 2023
    Assignee: Karlsruher Institut für Technologie
    Inventors: Uwe Bog, Michael Hirtz, Harald Fuchs, Jasmin Aghassi, Gabriel Cadilha Marques, Subho Dasgupta, Ben Breitung, Horst Hahn
  • METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUBSTRATE, MICROELECTRONIC DEVICE AND METHOD FOR THE PRODUCTION THEREOF
    Publication number: 20210358880
    Abstract: The invention relates to a method (110) for producing an electrically conductive connection (112, 112?) on a substrate (114), comprising the following steps: a) providing a substrate (114), wherein the substrate (114) is configured for receiving an electrically conductive connection (112, 112?); b) providing a reservoir of an electrically conductive liquid alloy, wherein the reservoir has a surface at which the alloy has an insulating layer; c) providing a capillary (120) configured for taking up the electrically conductive liquid alloy; d) penetrating of a tip (122) of the capillary (120) under the surface of the reservoir and taking up of a portion of the alloy from the reservoir; and e) applying the portion of the alloy at least partly to the substrate (114) in such a manner that an electrically conductive connection (112, 112?) is formed from the alloy on the substrate (114), wherein the alloy remains on the substrate (114) by adhesion.
    Type: Application
    Filed: August 22, 2019
    Publication date: November 18, 2021
    Applicant: Karlsruher Institut für Technologie
    Inventors: Uwe Bog, Michael Hirtz, Harald Fuchs, Jasmin Aghassi, Gabriel Cadilha Marques, Subho Dasgupta, Ben Breitung, Horst Hahn
  • Full polymer microresonators
    Patent number: 9559482
    Abstract: The present invention relates to a microresonator, in particular a full polymer microresonator, a method for producing the microresonator, and the use of the microresonator as a microlaser and/or molecular sensor.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: January 31, 2017
    Assignee: Karlsruher Institut für Technologie
    Inventors: Uwe Bog, Sebastian Köber, Christian Koos, Tobias Wienhold, Sentayehu Wondimu
  • FULL POLYMER MICRORESONATORS
    Publication number: 20160064889
    Abstract: The present invention relates to a microresonator, in particular a full polymer microresonator, a method for producing the microresonator, and the use of the microresonator as a microlaser and/or molecular sensor.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 3, 2016
    Inventors: Uwe BOG, Sebastian KÖBER, Christian KOOS, Tobias WIENHOLD, Sentayehu WONDIMU