Abstract: In a method for producing a component, a first layer composite is first produced, comprising a structured layer and a trench filled with an insulating material. The structured layer is electrically conductive at least in a first region. The trench filled with an insulating material extends outwards from a first surface of the structured layer and is arranged in the first region of the structured layer. The first surface of the structured layer faces a first surface of the first layer composite. The method additionally has the step of producing a second layer composite, which has a first depression in a first surface of the second layer composite, and the step of connecting the first layer composite to the second layer composite. The first surface of the first layer composite adjoins the first surface of the second layer composite at least in some regions, said filled trench being arranged within the lateral position of the first depression.

Abstract: In a method for producing a component, a first layer composite is first produced, comprising a structured layer and a trench filled with an insulating material. The structured layer is electrically conductive at least in a first region. The trench filled with an insulating material extends outwards from a first surface of the structured layer and is arranged in the first region of the structured layer. The first surface of the structured layer faces a first surface of the first layer composite. The method additionally has the step of producing a second layer composite, which has a first depression in a first surface of the second layer composite, and the step of connecting the first layer composite to the second layer composite. The first surface of the first layer composite adjoins the first surface of the second layer composite at least in some regions, said filled trench being arranged within the lateral position of the first depression.

Abstract: A method for producing a component, especially a micromechanical, micro-electro-mechanical or micro-opto-electro-mechanical component, as well as such a component which has an active structure that is embedded in a layer structure. Strip conductor bridges are formed by etching first and second depressions having a first and second, different etching depth into a covering layer of a first layer combination that additionally encompasses a substrate and an insulation layer. The deeper depression is used for insulating the strip conductor bridge while the shallower depression provides a moving space for the active structure with the moving space being bridged by the strip conductor bridge.

Abstract: A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites.

Abstract: A method for producing a component, especially a micromechanical, micro-electro-mechanical or micro-opto-electro-mechanical component, as well as such a component which has an active structure that is embedded in a layer structure. Strip conductor bridges are formed by etching first and second depressions having a first and second, different etching depth into a covering layer of a first layer combination that additionally encompasses a substrate and an insulation layer. The deeper depression is used for insulating the strip conductor bridge while the shallower depression provides a moving space for the active structure with the moving space being bridged by the strip conductor bridge.

Abstract: A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites.

Abstract: A method for producing a silicon torsion spring capable, for example, of reading the rotation rate in a microstructured torsion spring/mass system. The system that is produced achieves a low torsional stiffness compared to a relatively high transverse stiffness in the lateral and vertical directions. The method proceeds from a wafer or wafer composite and, upon suitable mask coverage, a spring with a V-shaped cross section is formed by anisotropic wet-chemical etching which preferably extends over the entire wafer thickness and is laterally delimited only by [111] planes. Two of the wafers or wafer composites prepared in this way are rotated through 180° and joined to one another oriented mirrorsymmetrically with respect to one another, so that overall the desired X-shaped cross section is formed.

Abstract: A micromechanical rotation rate sensor based on the Coriolis principle includes two plate-like oscillators arranged one above the other in two planes for excitation to oscillate by means of an electrostatic drive. Three elements in each case form an oscillator structure. The oscillators are in each case suspended on opposite side edges by at least one web between an associated plate-like support and an associated drive plate element. The two supports and the two drive plate elements are, in each case, arranged one above the other in layers. A fixed plate element is located between the two drive plate elements so that, in each case, an identical narrow drive gap is defined between the drive plate elements. The drive gap is considerably smaller than the distance between the plate-like oscillators.

Abstract: Strictly out-of-phase stimulation of the two oscillators of a micro-mechanical rate-of-rotation sensor based on the Coriolis principle, having two-plate like oscillators arranged in layers one above another in two parallel planes and capable of being stimulated to oscillate perpendicular to the planes by means of an electrostatic drive, is achieved by the oscillators each being connected via at least one spring to a couple element formed, in each case, in the same wafer layer. The couple elements are mirror-symmetrically configured with respect to a mid-plane between the oscillators and connected to each other by a coupling web arranged therebetween to form a couple structure for the oscillators.

Abstract: A micromechanical rate-of-rotation sensor based on the coriolis principle includes two plate-like oscillators electrostatically driven to oscillate out-of-phase. The oscillators are arranged one above another in alignment to oscillate via plate-like support structures separated from one another by a very small drive capacitor gap. By suitable selection of the natural frequency of the support structure parts, due to a significantly-larger distance between the oscillators, it is possible to achieve larger amplitudes of oscillation and, hence, a high oscillation quality, unlimited by the drive capacitor gap (which is narrow for reasons of good stimulation at small excitation voltages). The two oscillator structures in each case preferably comprise two electrically mutually insulated bonded parts suspended via springs within a frame and configured so that essentially only rotational oscillator movements are possible with linear movements of the oscillators in the .+-.z spatial direction largely suppressed.