Patents by Inventor Uwe Bruch

Uwe Bruch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Arrangement for transferring information/structures to wafers
    Patent number: 7401549
    Abstract: An arrangement for transferring information/structures to wafers uses a stamp on which the information/structures to be transferred have been applied as elevated structures. The wafer is fixed on a chuck and is provided with a plastically deformable auxiliary patterning layer. In various implementations, the dimensions of the stamp approximately correspond to those of the wafer, the stamp is provided with the elevated structures essentially over the whole area, and/or the stamp and the wafer are in each case provided with mutually assigned pairs of alignment marks in such a way that the stamp can be positioned in a predetermined position on the wafer by means of an infrared positioning system and can be pressed into the plastically deformable auxiliary patterning layer.
    Type: Grant
    Filed: March 17, 2004
    Date of Patent: July 22, 2008
    Assignee: Infineon Technologies AG
    Inventors: Jens Staecker, Uwe Bruch, Heiko Hommen
  • Arrangement for transferring information/structures to wafers
    Publication number: 20040219803
    Abstract: An arrangement for transferring information/structures to wafers uses a stamp on which the information/structures to be transferred have been applied as elevated structures. The wafer is fixed on a chuck and is provided with a plastically deformable auxiliary patterning layer. In various implementations, the dimensions of the stamp approximately correspond to those of the wafer, the stamp is provided with the elevated structures essentially over the whole area, and/or the stamp and the wafer are in each case provided with mutually assigned pairs of alignment marks in such a way that the stamp can be positioned in a predetermined position on the wafer by means of an infrared positioning system and can be pressed into the plastically deformable auxiliary patterning layer.
    Type: Application
    Filed: March 17, 2004
    Publication date: November 4, 2004
    Inventors: Jens Staecker, Uwe Bruch, Heiko Hommen