Abstract: The present invention is directed to a method for detaching two substrates bonded by an adhesive, in particular by treating with a debonding agent. In addition, the present invention relates to the use of the method in recycling parts of the electronic devices. The method comprises the steps of: (1) treating two substrates bonded by an adhesive with a debonding agent comprising acetone and/or oleic acid at a temperature from 20° C. to 90° C., and (2) removing the substrates from the adhesive.

Abstract: Disclosed is a moisture reactive hot melt adhesive composition prepared from a combination comprising a polyisocyanate; a polyol; a MA-SCA acid; one or both of an inorganic filler or an organosilane; optionally a thermoplastic polymer; and optionally one or more additives. Useful polyols include poly(hexanediol adipate), a polyester diol having a structure of Formula 1 or of Formula 2 and combinations thereof. Formula 1 is: H—[O(CH2)mOOC(CH2)nCO]k—O(CH2)m—OH; m and n are each an even integer; m+n =8; m and n are each independently selected from 2, 4 or 6; k is an integer from 9 to 55; and the polyol of Formula 1 has a number average molecular weight of about 2,000 to about 11,000. Formula 2, a polycaprolactone polyol, is: HO—[(CH2)5COO]p—R1—[OOC(CH2)5]1—OH; R1 is an initiator such as 1,4?-butanediol, 1,6?-hexanediol, or ethylene glycol; p is an integer from 0 to 96; q is an integer from 0 to 96; p+q=16 to 96; and the polyol has a number average molecular weight of about 2,000 to about 11,000 or less.

Abstract: The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

Abstract: The present invention lies in the field of 3D printing methods. In particular, the invention relates to 3D printing methods for the production of a 3D part in a layer-by-layer manner, wherein the printable composition is a pasty polyurethane composition comprising at least one polyisocyanate resin, at least one monomer and/or prepolymer that is polymerizable by exposure to radiation and at least one photoinitiator, wherein the pasty polyurethane composition has a viscosity factor (1.5/15) of at least 2 at application temperature.

Abstract: The present invention refers to a process for the production of hot melt adhesives having a low emission of monomeric isocyanates upon heating wherein in a first step a polyurethane prepolymer is generated which is subsequently reacted with a chain extender. Further, the present invention refers to hot melt adhesives obtained by the inventive process.

Abstract: The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.

Abstract: The present invention relates to a hot-melt adhesive composition comprising at least one polyester polyol based on Betulin and at least one NCO-terminated compound as well as a method for the production of a laminated article using the inventive hot-melt adhesive composition.

Abstract: This invention relates to a surface-deactivated solid polyisocyanate and a thermally curable adhesive composition comprising the same, which are suitable for assembling articles of various substrates such as plastic materials. In particular, the present invention relates to a surface-deactivated solid polyisocyanate and a thermally curable adhesive composition comprising the same which is storage stable at room temperature, can be cured at a temperature lower than 100° C. and meanwhile have excellent adhesion and mechanical properties when cured.

Abstract: The invention relates to a polyurethane (PU) reactive hot melt adhesive removable at elevated temperature as well as having a high bonding strength at room temperature.

Abstract: The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.

Abstract: A reactive hot melt adhesive comprising a blend of a (meth)acrylate polymer, a polyurethane polymer containing (meth)acrylate groups and a polyurethane prepolymer containing NCO-groups wherein the content of low molecular weight (meth)acrylate urethanes is less than 1 wt % of the adhesive. The adhesive provides a fast and improved green strength during application.

Abstract: The present invention describes reaction products from 2,4?-diphenylmethane diisocyanate with a content of at least 95 wt. % of 2,4? isomer with at least one polyether-polyol and/or polyalkylene glycol with a molecular weight of less than 1,000 and/or one crystalline or partly crystalline or vitreously amorphous polyester-polyol and optionally polyester-polyols and/or polyether-polyols which are liquid at room temperature and have molecular weights of greater than 1,000 can be converted into adhesive compositions which have a very low content of monomeric diisocyanate of less than 0.5, preferably less than 0.25 wt. %. Such hot melt adhesive compositions have a high melt stability and a low viscosity, in addition to the low content of monomeric diisocyanate.

Abstract: The invention relates to a polyurethane (PU) reactive hot melt adhesive removable at elevated temperature as well as having a high bonding strength at room temperature.

Abstract: Cross-linkable foamable composition with low content of monomeric isocyanates, containing a pre-polymer of polyester diols and/or polyether dials reacted i) with asymmetric aromatic diisocyanates to form a reaction product with OH and NCO groups, ii) subsequent addition of and reaction with symmetric aromatic diisocyanate in a quantity at least equivalent to the available OH-groups, 0.1 to 30 wt % additives, at least one propellant, wherein the polyols have a molar mass (MN) of less than 5000 g/mol, and the reaction product has a content of less than 0.1 wt % monomeric asymmetric isocyanate and less than 2 wt % monomeric symmetric isocyanate.

Abstract: Solvent-free moisture-curing polyurethane compositions are described, containing 99.9% to 75% by weight of at least one polyurethane prepolymer having free isocyanate groups, prepared by reaction of at least one polyol, selected from the group of the polyether polyols and polyester polyols, with at least one polyisocyanate in stoichiometric excess, at least one polyol being a recycled polyethylene terephthalate polyol. In addition, this composition contains 0.1% to 25% by weight of at least one additive selected from the group of the catalysts, resins, plasticisers, fillers, pigments, stabilisers, adhesion promoters and further polymers. The sum total of the aforementioned constituents is 100% by weight. These compositions can be used as a one-component adhesive, reactive hot-melt adhesive, coating material or sealant.

Abstract: A reactive hot melt adhesive comprising a blend of a (meth)acrylate polymer, a polyurethane polymer containing (meth)acrylate groups and a polyurethane prepolymer containing NCO-groups wherein the content of low molecular weight (meth)acrylate urethanes is less than 1 wt % of the adhesive. The adhesive provides a fast and improved green strength during application.

Abstract: Polyether block copolymers of the general structure B-(A-OH)n are described, where n is greater than or equal to 2 and blocks A are made up of polyoxypropylene units and the central block B of polyoxytetramethylene, polyoxyethylene, polybutadiene, polyisoprene, polyacrylate, polymethacrylate, polyamide, polyurethane, or polyester units. These polyether block copolymers are suitable for the manufacture of compositions that serve as the basis for preparations for use as a one-component moisture-hardening or two-component adhesive or sealant, for assembly bonding, for areal bonding, and/or for coating, as a reactive melt adhesive or as a laminating adhesive.

Abstract: A solvent-free moisture-curing polyurethane hot-melt adhesive composition, in which the adhesive comprises the following components: 20 to 85 wt % of a polyurethane prepolymer with free isocyanate groups produced from at least one polyol from the group of polyether polyols, polyester polyols, polyalkylene polyols and mixtures thereof with an excess of at least one polyisocyanate, the prepolymer having a monomeric diisocyanate content of below 1 wt %, 4 to 40 wt % of at least one acrylate copolymer with a molecular weight of below 60,000 g/mol, 3 to 35 wt % of a thermoplastic polyester with a number-average molecular weight (MN) of below 6000 g/mol, which comprises fewer than 1.4 NCO-reactive groups, and 0 to 25 wt % of at least one additive from the group of catalysts, resins, plasticizers, fillers, pigments, stabilizers or adhesion promoters, the sum of the constituents being equal to 100 wt %.

Abstract: A reactive melt adhesive containing 30 to 70% of at least one prepolymer having at least two isocyanate groups having a molecular weight below 6000 g/mol, manufactured from polyether polyols and/or polyester polyols reacted with a molar excess of diisocyanates, the prepolymer containing less than 1% monomeric diisocyanate; 30 to 70 wt % of a thermoplastic polyester having a number-average molecular weight (MN) below 6000 g/mol, which comprises fewer than 1.4 groups reactive with NCO; and up to 30 wt % additives from the group of the catalysts, resins, plasticizers, fillers, pigments, stabilizers, or adhesion promoters.

Abstract: Cross-linkable foamable composition with low content of monomeric isocyanates, containing a pre-polymer of polyester diols and/or polyether dials reacted i) with asymmetric aromatic diisocyanates to form a reaction product with OH and NCO groups, ii) subsequent addition of and reaction with symmetric aromatic diisocyanate in a quantity at least equivalent to the available OH-groups, 0.1 to 30 wt % additives, at least one propellant, wherein the polyols have a molar mass (MN) of less than 5000 g/mol, and the reaction product has a content of less than 0.1 wt % monomeric asymmetric isocyanate and less than 2 wt % monomeric symmetric isocyanate.