Abstract: A freight container configured to fit in an aircraft cargo hold includes a floor element. First and second parallel side walls extend away from first and second opposite edges of the floor element base surface. A top wall, parallel to a floor element resting surface, extends between edges of the first and second side walls, which edges are remote from the first and second edges. A front wall extends between the first and second side walls from a base surface third edge to a top wall front edge. The front wall has a first front wall portion, extending from the base surface third edge at a first angle of at least 90° to the resting surface. The front wall has a second front wall portion, extending from the top wall front edge at a second angle of less than 180° and more than 90° to the top wall.

Abstract: A freight carrier configured to be received in an aircraft cargo hold, a system of one or more such freight carriers and a receiving platform, and a platform, are each provided. The freight carrier includes a floor element having a resting surface configured to lie on a floor surface of a cargo hold of an aircraft. The freight carrier is configured such that its resting surface can be moved over a floor surface in a floor plane. The floor element has a base element having a base surface. The base surface is situated on the base element such that the base surface faces away from the resting surface. The resting surface is provided with an arrangement to allow the freight carrier to be slid over the floor surface. The floor element has a cavity which extends toward the base surface between the front portion and the rear portion.

Abstract: A load carrier for an aircraft cargo hold includes a bottom element with a support surface, the load carrier being movable over a floor surface in a floor plane while the support surface faces the floor surface, the bottom element having a base surface. The support surface has rolling elements rotatable about a rotation axis oriented where a parallel to the axis runs parallel to the floor plane, and the rolling elements being retained on the bottom element where the rotation axis of each of the rolling elements can be rotated about a vertical axis running perpendicularly to the floor plane. A load carrier can include a bottom element, the support surface of which has outlet openings, through which air can exit from the support surface to form an air cushion under the support surface. A load carrier can include a bottom element the support surface of which has slider elements.

Abstract: A cargo loading platform for an aircraft, with a plate-like supporting structure, which is configured to support or to receive cargo, and a lifting device. The lifting device is arranged asymmetrically on the plate-like supporting structure and can be moved from a stowage position to a lifting position. In the stowage position, the lifting device is arranged here above a lower side of the plate-like supporting structure and, in the lifting position, is at least partially arranged below the lower side of the plate-like supporting structure. This permits asymmetrical raising of the plate-like supporting structure by the lifting device, as a result of which steps during the transportation of the cargo loading platform can be easily and rapidly overcome. Furthermore, a cargo loading apparatus and a cargo container each with such a cargo loading platform, and also an aircraft with such a cargo loading apparatus are described.

Abstract: A sensor carrier having a main plane of extension, a first side parallel to the main plane of extension, a second side parallel to the main plane of extension, which is situated opposite the first side, and at least one electrical contact surface situated on the second side. At least one stress-measuring structure is embedded in the sensor carrier. A sensor module having such a sensor carrier as well as to a component having a sensor module having such a sensor carrier, are also described. A method for calibrating a sensor module and a method for operating a sensor module are also described.

Abstract: A cargo loading platform for an aircraft, with a plate-like supporting structure, which is configured to support or to receive cargo, and a lifting device. The lifting device is arranged asymmetrically on the plate-like supporting structure and can be moved from a stowage position to a lifting position. In the stowage position, the lifting device is arranged here above a lower side of the plate-like supporting structure and, in the lifting position, is at least partially arranged below the lower side of the plate-like supporting structure. This permits asymmetrical raising of the plate-like supporting structure by the lifting device, as a result of which steps during the transportation of the cargo loading platform can be easily and rapidly overcome. Furthermore, a cargo loading apparatus and a cargo container each with such a cargo loading platform, and also an aircraft with such a cargo loading apparatus are described.

Abstract: A housing for a micromechanical sensor element, including a cavity in which the sensor element is disposable, and a damping element, the micromechanical sensor element being immobilizable in the cavity by the damping element so that the damping element and the sensor element together have a substantially common center of mass.

Abstract: A semiconductor package. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and lead frame are embedded into the molded substrate. The lead frame is also positioned between the first side and the second side of the semiconductor package to provide a first electrical connection between the first side and the second side of the semiconductor package.

Abstract: A sensor carrier having a main plane of extension, a first side parallel to the main plane of extension, a second side parallel to the main plane of extension, which is situated opposite the first side, and at least one electrical contact surface situated on the second side. At least one stress-measuring structure is embedded in the sensor carrier. A sensor module having such a sensor carrier as well as to a component having a sensor module having such a sensor carrier, are also described. A method for calibrating a sensor module and a method for operating a sensor module are also described.

Abstract: A housing for a micromechanical sensor element, including a cavity in which the sensor element is disposable, and a damping element, the micromechanical sensor element being immobilizable in the cavity by the damping element so that the damping element and the sensor element together have a substantially common center of mass.

Abstract: A method for manufacturing a micromechanical component and a micromechanical component. The micromechanical component includes a sensor substrate and a cap situated thereon. For creating the cap, a plurality of openings is introduced into a cap substrate in a delimited area on the surface of the front side in the form of microperforations. The openings end in the cap substrate, i.e. they do not go all the way through the cap substrate and are therefore shallow. The cap substrate is then placed on the sensor substrate, whereby the front side of the cap substrate including the plurality of openings is directed toward the sensor substrate. A portion of the cap substrate is removed from its back side by back-thinning using a grinding process or another semiconductor process. The removal of the cap substrate material from the back side creates access to the openings.

Abstract: A semiconductor package. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and lead frame are embedded into the molded substrate. The lead frame is also positioned between the first side and the second side of the semiconductor package to provide a first electrical convection between the first side and the second side of the semiconductor package.

Abstract: The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

Abstract: A sensor device, having a flexible printed circuit board that has a fastening section for a chip structure, a chip structure situated on the fastening section of the flexible printed-circuit board, and a damper element for damping the chip structure from mechanical influences. The fastening section of the flexible printed circuit board, the chip structure and the damper element are situated one on top of the other.

Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

Abstract: The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

Abstract: A sensor device, having a flexible printed circuit board that has a fastening section for a chip structure, a chip structure situated on the fastening section of the flexible printed-circuit board, and a damper element for damping the chip structure from mechanical influences. The fastening section of the flexible printed circuit board, the chip structure and the damper element are situated one on top of the other.

Abstract: Measures are introduced to make possible a low-cost packaging of sensor chips having a media access. For this purpose, the sensor chip is first mounted on a substrate and is contacted. The sensor chip is then at least partially embedded in a molding compound. Finally, at least one portion of the media access is produced by the subsequent structuring of the molding compound.

Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

Abstract: A control and regulation device for a vehicle travel drive, which comprises two hydrostatic transmissions (3, 4) of adjustable transmission ratios, each comprising a hydraulic pump (12, 13) and a hydraulic motor (14, 15), which are in driving connection with two vehicle track arrangements (18, 19) and have each an adjustment device (30, 24; 31, 25) controllable with control signals (v.sub.l, v.sub.r) for adjusting the transmission ratio, with a control section comprising a desired-value setting apparatus (5) and a signal processing means (42, 43), whereby the desired-value setting means sets transmission ratio desired-values of each hydrostatic transmission, employing respective adjustable control levers (36, 37), and outputs desired-value signals (s.sub.l, s.sub.r), and the signal processing apparatus processes desired-value signals to control signals (s.sub.l, s.sub.r) and outputs the latter.