Abstract: A sensor carrier having a main plane of extension, a first side parallel to the main plane of extension, a second side parallel to the main plane of extension, which is situated opposite the first side, and at least one electrical contact surface situated on the second side. At least one stress-measuring structure is embedded in the sensor carrier. A sensor module having such a sensor carrier as well as to a component having a sensor module having such a sensor carrier, are also described. A method for calibrating a sensor module and a method for operating a sensor module are also described.

Abstract: A housing for a micromechanical sensor element, including a cavity in which the sensor element is disposable, and a damping element, the micromechanical sensor element being immobilizable in the cavity by the damping element so that the damping element and the sensor element together have a substantially common center of mass.

Abstract: A semiconductor package. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and lead frame are embedded into the molded substrate. The lead frame is also positioned between the first side and the second side of the semiconductor package to provide a first electrical connection between the first side and the second side of the semiconductor package.

Abstract: A sensor carrier having a main plane of extension, a first side parallel to the main plane of extension, a second side parallel to the main plane of extension, which is situated opposite the first side, and at least one electrical contact surface situated on the second side. At least one stress-measuring structure is embedded in the sensor carrier. A sensor module having such a sensor carrier as well as to a component having a sensor module having such a sensor carrier, are also described. A method for calibrating a sensor module and a method for operating a sensor module are also described.

Abstract: A housing for a micromechanical sensor element, including a cavity in which the sensor element is disposable, and a damping element, the micromechanical sensor element being immobilizable in the cavity by the damping element so that the damping element and the sensor element together have a substantially common center of mass.

Abstract: A method for manufacturing a micromechanical component and a micromechanical component. The micromechanical component includes a sensor substrate and a cap situated thereon. For creating the cap, a plurality of openings is introduced into a cap substrate in a delimited area on the surface of the front side in the form of microperforations. The openings end in the cap substrate, i.e. they do not go all the way through the cap substrate and are therefore shallow. The cap substrate is then placed on the sensor substrate, whereby the front side of the cap substrate including the plurality of openings is directed toward the sensor substrate. A portion of the cap substrate is removed from its back side by back-thinning using a grinding process or another semiconductor process. The removal of the cap substrate material from the back side creates access to the openings.

Abstract: A semiconductor package. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and lead frame are embedded into the molded substrate. The lead frame is also positioned between the first side and the second side of the semiconductor package to provide a first electrical convection between the first side and the second side of the semiconductor package.

Abstract: The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

Abstract: A sensor device, having a flexible printed circuit board that has a fastening section for a chip structure, a chip structure situated on the fastening section of the flexible printed-circuit board, and a damper element for damping the chip structure from mechanical influences. The fastening section of the flexible printed circuit board, the chip structure and the damper element are situated one on top of the other.

Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

Abstract: The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

Abstract: A sensor device, having a flexible printed circuit board that has a fastening section for a chip structure, a chip structure situated on the fastening section of the flexible printed-circuit board, and a damper element for damping the chip structure from mechanical influences. The fastening section of the flexible printed circuit board, the chip structure and the damper element are situated one on top of the other.

Abstract: Measures are introduced to make possible a low-cost packaging of sensor chips having a media access. For this purpose, the sensor chip is first mounted on a substrate and is contacted. The sensor chip is then at least partially embedded in a molding compound. Finally, at least one portion of the media access is produced by the subsequent structuring of the molding compound.

Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

Abstract: Unsaturated compounds are separated from liquid hydrocarbon mixtures by adsorbing the unsaturated compounds on a macroporous cation exchange resin and desorbing the unsaturated compounds with a mononuclear aromatic compound.

Abstract: Method of low-loss thermal energy storage in and withdrawal from a heat accumulator connected with an energy source and a heat consumer in a circulatory system through which a heat-carrying flow medium circulates which includes passing the flow medium through the energy source so as to withdraw thermal energy from the energy source and effect absorption of the thermal energy by the flow medium, guiding the flow medium in respective layers within the heat accumulator in a direction from the center of the heat accumulator toward the periphery thereof so as to store the thermal energy in a heat storage mass disposed in the heat accumulator; and guiding the flow medium in the layers thereof through the heat accumulator in a direction from the periphery of the heat accumulator to the center thereof, and passing the flow medium from the heat accumulator through the consumer so as to withdraw thermal energy therefrom and transfer it to the consumer; and apparatus therefor.

Abstract: Unsaturated hydrocarbons are separated from liquid mixtures containing same by adsorbing the unsaturated compound using a metal-loaded macroporous exchange resin and desorbing the unsaturated compound using a normally gaseous hydrocarbon.

Abstract: Aromatic compounds can be separated from slack wax in a continuous cyclic process using a macroporous metal ion loaded cation exchange resin involving successive steps of adsorption, purge, desorption and purge.