Abstract: The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler for copper-deposition, wherein at least one leveler is a ruthenium compound, and to a process for the electrolytic deposition of copper, in particular for filling a blind micro Vertical Interconnect Access (VIA), through hole VIA, trench and similar structures on printed circuit boards, chip carriers and semiconductor wafers.

Abstract: Vertical system for the plating treatment of a work piece, the system comprising at least two treatment modules, wherein retaining devices for the work pieces are provided in the treatment modules, and at least one transport device including at least one gripping device, which retains the work piece and has a respective fastening device, and each fastening device comprises first and second clamping devices, each associated with one side of the work piece, wherein both the first and second clamping devices are displaceable for gripping and releasing the work pieces, wherein the gripping device comprises at least two fastening devices that are spaced apart from one another, each of the first and second clamping devices are moveable torsion bars as a result of which the work piece is tensioned between the fastening devices during clamping parallel to its first side.

Abstract: The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces (1), such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces (1) are transported on a conveying path by means of conveying members (6, 6?, 6?, 7). The treatment unit comprises carrier elements (4) with recesses (21), said carrier elements (4) being oriented to be parallel to the conveying path, and at least one module system for carrying the conveying members (6, 6?, 6?, 7) that consist of insertion elements (14, 26), preferably arranged in pairs, the at least one module system being configured such that it registers with and is preferably slidable into the recesses (21) of the carrier elements (4). The treatment unit is preferably utilized in horizontal conveyorized lines.

Abstract: The present invention relates to a vertical system for the plating treatment of a work piece (W), the said system including at least two treatment modules (100) and at least one transport device for conveying at least one work piece (W) to a treatment module (100) and for transferring the work piece (W) to retaining devices (130) in the treatment module (100). The retaining devices (130) for the work piece (W) are provided in the treatment modules (100). The transport device includes at least one gripping device (10) retaining the work piece (W) each with at least one fastening device (20, 30). Each fastening device (20, 30) includes first clamping devices (25, 35) that are each associated with one side of the work piece (W) and second clamping devices (26). At least one first clamping device (25, 35) associated with a first side of the work piece (W) is designed and disposed such that the position of the first side of the work piece (W) can be defined by the first clamping device (25, 35).

Abstract: An apparatus and a corresponding method for drying articles which have been treated (1) are proposed, the apparatus including transport means (3) for transporting the treated articles (1) along a transport path. Gas outlet devices (4, 5) disposed opposite one another are arranged above the transport path. A gaseous drying medium is supplied separately by fan means to the gas outlet apertures by supply lines (8, 9). A pressure associated with each gas outlet device (4, 5) is detected and a gas flow associated with the gas outlet device (4, 5) is regulated by regulating means as a function of this pressure.

Abstract: The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces (1), such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces (1) are transported on a conveying path by means of conveying members (6, 6?, 6?, 7). The treatment unit comprises carrier elements (4) with recesses (21), said carrier elements (4) being oriented to be parallel to the conveying path, and at least one module system for carrying the conveying members (6, 6?, 6?, 7) that consist of insertion elements (14, 26), preferably arranged in pairs, the at least one module system being configured such that it registers with and is preferably slidable into the recesses (21) of the carrier elements (4). The treatment unit is preferably utilized in horizontal conveyorized lines.

Abstract: The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R1 and R2=alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R3=R1, R1—O, R1—S, amino or substituted amino, wherein R1 and R2 may especially be phenyl or substituted phenyl.

Abstract: A process to pretreat copper surfaces for tight bonding to organic substrates as those found in multilayer printed circuit boards includes first treating the copper with a solution containing hydrogen peroxide, and at least one acid, and at least one nitrogen-containing five-member heterocyclic compound which does not contain sulfur, selenium or tellurium atoms in the heterocycle. Thereafter the copper surfaces are brought into contact with a second solution containing at least one adhesion-promoting compound from the group consisting of sufinic acid, selinic acid, telluric acid, and heterocyclic compounds that contain at least one sulfur, and/or selenium and/or tellurium atom in the heterocycie and also sulfonium, selenonium and telluronium salts.

Abstract: The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: 1