Abstract: A method for producing an electronic sensor module includes applying first soldering material onto electrical soldering pads of a printed circuit board element and/or electrical soldering pads of a printed circuit board element contact side of a sensor carrier, arranging the sensor carrier with the electrical soldering pads of the printed circuit board element contact side on the electrical soldering pads of the printed circuit board element to produce electrical connections between connecting lines and the printed circuit board element, applying second soldering material onto electrical connecting elements of a sensor element and/or soldering pads of the sensor receptacle, arranging the sensor element in the sensor receptacle such that the second soldering material produces electrical connections between the electrical connecting elements of the sensor element and the soldering pads of the sensor receptacle, and reflow-soldering the first soldering material and the second soldering material in a joint reflow

Abstract: An electrical assembly for a motor vehicle transmission includes a printed circuit board (PCB), at least two contact surfaces, at least two contact elements, and a potting compound. The PCB has a component side and the two contact surfaces are arranged on the component side. The contact elements are each electrically connected by a PCB-side first end portion to one of the contact surfaces. The potting compound is arranged on the component side of the PCB, and the contact elements are partly embedded therein. The potting compound directly contacts the contact surfaces and the PCB-side end portions of the contact elements and covers the same. The contact elements protrude from the potting compound by second end portions facing away from the PCB. The electrical assembly includes a chip protection frame that protrudes outward from the potting compound and forms contact chambers for the second end portions of the contact elements.

Abstract: A method for producing an electronic sensor module includes applying first soldering material onto electrical soldering pads of a printed circuit board element and/or electrical soldering pads of a printed circuit board element contact side of a sensor carrier, arranging the sensor carrier with the electrical soldering pads of the printed circuit board element contact side on the electrical soldering pads of the printed circuit board element to produce electrical connections between connecting lines and the printed circuit board element, applying second soldering material onto electrical connecting elements of a sensor element and/or soldering pads of the sensor receptacle, arranging the sensor element in the sensor receptacle such that the second soldering material produces electrical connections between the electrical connecting elements of the sensor element and the soldering pads of the sensor receptacle, and reflow-soldering the first soldering material and the second soldering material in a joint reflow

Abstract: An electrical contact assembly for connecting a press-in contact to an electronic circuit includes a circuit board, which is provided with the electronic circuit, a receiving opening for pressing in a press-in contact, which receiving opening is continuously provided with an electrically conductive inner wall, and at least one conducting track of the circuit board, which conducting track is electrically connected to the inner wall and to the electronic circuit. The receiving opening is formed on a contact body electrically connected to the conducting track, which contact body is applied to a component side of the circuit board as an SMT-capable component.

Abstract: An electrical assembly for a motor vehicle transmission includes a printed circuit board (PCB), at least two contact surfaces, at least two contact elements, and a potting compound. The PCB has a component side and the two contact surfaces are arranged on the component side. The contact elements are each electrically connected by a PCB-side first end portion to one of the contact surfaces. The potting compound is arranged on the component side of the PCB, and the contact elements are partly embedded therein. The potting compound directly contacts the contact surfaces and the PCB-side end portions of the contact elements and covers the same. The contact elements protrude from the potting compound by second end portions facing away from the PCB. The electrical assembly includes a chip protection frame that protrudes outward from the potting compound and forms contact chambers for the second end portions of the contact elements.

Abstract: An electrical contact assembly for connecting a press-in contact to an electronic circuit includes a circuit board, which is provided with the electronic circuit, a receiving opening for pressing in a press-in contact, which receiving opening is continuously provided with an electrically conductive inner wall, and at least one conducting track of the circuit board, which conducting track is electrically connected to the inner wall and to the electronic circuit. The receiving opening is formed on a contact body electrically connected to the conducting track, which contact body is applied to a component side of the circuit board as an SMT-capable component.

Abstract: A method for manufacturing a sensor, in particular for recording rotational speed. At least one stamped grid is provided for electrically contacting the sensor, in particular a sensor element of the sensor. In addition, at least one homogenization plate is provided for influencing a magnetic field, the stamped grid and the homogenization plate being connected by at least one holder. The holder fixes the stamped grid and the homogenization plate in place positively and/or non-positively.

Abstract: A method for manufacturing a sensor, in particular for recording rotational speed. At least one stamped grid is provided for electrically contacting the sensor, in particular a sensor element of the sensor. In addition, at least one homogenization plate is provided for influencing a magnetic field, the stamped grid and the homogenization plate being connected by at least one holder. The holder fixes the stamped grid and the homogenization plate in place positively and/or non-positively.

Abstract: The inductive sensor has an electrical coil (14) having winding end portions (114) and current conductors (15) having conductor end portions (115) which are electrically contacted by the winding end portions (114) of the coil in a contact region (18) in the sensor housing (10). A permanently elastic material (26), advantageously silicone, encloses the contact region (18) between the conductor end portions (115) and the winding end portions (114). A temperature-resistant circumferential element (28) bearing on the housing (10) also encloses the contact region (18). This circumferential element (28) can be a polyimide strip or heat-resistant adhesive tape. This inductive sensor allows temperature fluctuation cycles to be increased by up to four times without damaging the coil wire and improves sensor durability.