Patents by Inventor Uwe Kreiser

Uwe Kreiser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for the thermal treatment of substrates
    Patent number: 7041610
    Abstract: In order to achieve temperature distribution, in particular a homogeneous temperature distribution in, for example, a substrate during a thermal treatment process of said substrate, a method is disclosed for the thermal treatment of substrates, in particular semi-conductor wafers, in a process chamber comprising at least one temperature distribution influencing element located in the process chamber. During thermal treatment, the spatial arrangement of the element is altered relative to the substrate and/or to the process chamber. A device for the thermal treatment of substrates in a process chamber is also disclosed, comprising at least one temperature distribution influencing element located in a process chamber wherein a device is provided in order to alter the spatial arrangement of the element relative to the substrate and/or to the process chamber during the thermal treatment process.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: May 9, 2006
    Assignee: Steag RTP Systems GmbH
    Inventors: Andreas Tillmann, Uwe Kreiser
  • Device for thermal treatment of substrates
    Patent number: 6953338
    Abstract: The aim of the invention is to reduce the formation of scratches in a device for the thermal treatment of substrates, in particular, semiconductor substrates, in a chamber in which the substrate is placed upon support elements. According to the invention, said aim is achieved by means of displaceable support elements.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: October 11, 2005
    Assignee: Steag RTP Systems GmbH
    Inventors: Uwe Kreiser, Karsten Weber, Wilfried Lerch, Michael Grandy, Patrick Schmid, Jürgen Niess, Olgun Altug
  • Device for thermal treatment of substrates
    Publication number: 20040029065
    Abstract: The aim of the invention is to reduce the formation of scratches in a device for the thermal treatment of substrates, in particular, semiconductor substrates, in a chamber in which the substrate is placed upon support elements. According to the invention, said aim is achieved by means of displaceable support elements.
    Type: Application
    Filed: July 28, 2003
    Publication date: February 12, 2004
    Inventors: Uwe Kreiser, Karten Weber, Wilfried Lerch, Michael Grandy, Patrick Schmid, Jurgen Niess, Olgun Altug