Patents by Inventor Uwe Luckner

Uwe Luckner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink for surface-mounted semiconductor devices
    Patent number: 7230831
    Abstract: A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: June 12, 2007
    Assignee: Infineon Technologies AG
    Inventors: Uwe Luckner, Georg Ernst, Manuel Carmona, Markus Fink
  • Heat sink for surface-mounted semiconductor devices
    Publication number: 20060158857
    Abstract: A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.
    Type: Application
    Filed: May 2, 2005
    Publication date: July 20, 2006
    Inventors: Uwe Luckner, Georg Ernst, Manuel Carmona, Markus Fink