Abstract: The object of a device for coupling loading and unloading devices with semiconductor machines is to couple devices required for the use of SMIF technology with semiconductor processing machines in which subsequent integration of SMIF technology is not possible, wherein the charging to be carried out after coupling is highly flexible and capable of managing increasing dimensions of semiconductor wafers. An adjustable receiving element for the loading and unloading device is provided inside a movable enclosure, this receiving element being displaceable between at least two planes situated one above the other, one plane serving for charging the loading and unloading device and every other plane being used for the charging of the semiconductor machine carried out by the loading and unloading device. The enclosure has aligning and holding elements for fastening to a coupling element which is aligned with the semiconductor processing machine.

Abstract: The invention relates to a manipulation device for precision adjustment of plane pattern bearing substrates being provided with two adjustment marks which are at different distances relative to a reference mark, which is, for example, a graduation plate. Such a substrate can be, for example, an intermediate negative or the like which is required in the course of a photolithographic mask production of integrated circuits. The manipulation device is constructed in such a manner that the pattern bearing substrate is substantially aligned relative to a reference mark by two orthogonal displacements and one rotation. This is accomplished by three displacement members which act upon a slide. Said slide, upon which the pattern bearing substrate is disposed, permits displacements parallel to the plane of the latter. Said displacement members are so arranged that the vectors of the orthogonal displacement actions pass one of the two adjustment marks.