Abstract: A chip assembly having a carrier having a cavity and at least one carrier contact, a chip arranged in the cavity and having at least one chip contact, and a wirebond wire, which electrically conductively connects the at least one chip contact to the at least one carrier contact, wherein the wirebond wire is flat-pressed in at least one subregion.

Abstract: The invention relates to a method for processing and/or handling solids and/or mixtures capable of deflagration, in particular for processing materials capable of deflagration in the chemical and pharmaceutical industry, wherein the processing and/or handling is carried out in an environment under a reduced pressure of <500 mbara and, when a deflagration cannot be ruled out measures for extinguishing the deflagration are commenced, where the processing and/or handling comprises one or more process steps selected from a group consisting of filtration, milling, sieving, mixing, homogenization, granulation, compacting, dispensing, drying, storage and transport in a transport vessel and also other steps in apparatuses having mechanical internals.

Abstract: A flowmeter is provided to have a measuring tube, in or on which a measuring system is arranged. The flowmeter includes pinch seal sleeves which are arranged at both ends of the measuring tube for connecting the measuring tube to a process pipeline. According to an exemplary configuration, the pinch seal sleeves and/or the inner surfaces of the pinch seal sleeves are composed of an electrically insulating material and/or coated with an electrically insulating material. To make the device lighter in enable fast installation, the measuring tube can be made flangeless.

Abstract: A flow meter has a measurement tube, in or on which the measurement system is arranged. In order to make the device more lightweight and to achieve faster installation, the measurement tube is flangeless.