Abstract: A depositing arrangement for evaporation of a material is disclosed herein. The depositing arrangement has an alkali metal or alkaline earth metal for deposition of the material on a substrate. The deposition arrangement has a first chamber configured for liquefying the material; a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve. The deposition arrangement has an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material; a heating unit to heat the material to higher temperatures before providing the liquid material in the evaporation zone; and one or more outlets for directing the vaporized material towards the substrate.

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material; a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and a support for the distribution pipe, wherein the support is connectable to a first drive or includes the first drive, wherein the first drive is configured for a translational movement of the support and the distribution pipe.

Abstract: A material deposition arrangement for depositing a material on a substrate in a vacuum deposition chamber is described. The material deposition arrangement includes at least one material deposition source having a crucible configured to evaporate the material, a distribution assembly configured for providing the evaporated material to the substrate, and a force application device configured for applying a contact force at a connection between the crucible and the distribution assembly.

Abstract: A depositing arrangement for evaporation of a material is disclosed herein. The depositing arrangement has an alkali metal or alkaline earth metal for deposition of the material on a substrate. The deposition arrangement has a first chamber configured for liquefying the material; a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve. The deposition arrangement has an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material; a heating unit to heat the material to higher temperatures before providing the liquid material in the evaporation zone; and one or more outlets for directing the vaporized material towards the substrate.

Abstract: A measurement assembly for measuring a deposition rate of an evaporated material is described. The measurement assembly includes an oscillation crystal for measuring the deposition rate, a measurement outlet for providing evaporated material to the oscillation crystal, and a magnetic closing mechanism configured for opening and closing the measurement outlet by magnetic force.

Abstract: A carrier for supporting at least one substrate during a sputter deposition process is provided. The carrier includes a carrier body and an insulating portion provided at the carrier body. The insulating portion provides a surface of an electrically insulating material, wherein the surface is configured to face one or more sputter deposition sources during the sputter deposition process.

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material; a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and a support for the distribution pipe, wherein the support is connectable to a first drive or includes the first drive, wherein the first drive is configured for a translational movement of the support and the distribution pipe.

Abstract: A material source arrangement for depositing a material on a substrate in a vacuum deposition chamber is described. The material source arrangement includes a distribution pipe being configured to be in fluid communication with a material source providing the material to the distribution pipe; and at least one nozzle configured for guiding the material provided in the distribution pipe to the vacuum deposition chamber. The nozzle includes a thread for repeatedly connecting and disconnecting the nozzle to the distribution pipe. Further, a deposition apparatus for depositing material on a substrate including a material source arrangement, a nozzle for a material source arrangement, and a method for providing a distribution pipe and a nozzle for a material source arrangement are described.

Abstract: A material deposition arrangement for depositing evaporated material on a substrate in a vacuum chamber is described. The material deposition arrangement includes a crucible for providing material to be evaporated; a linear distribution pipe in fluid communication with the crucible; and a plurality of nozzles in the distribution pipe for guiding the evaporated material into the vacuum chamber. Each nozzle may have a nozzle inlet for receiving the evaporated material, a nozzle outlet for releasing the evaporated material to the vacuum chamber, and a nozzle passage between the nozzle inlet and the nozzle outlet. The nozzle passage of at least one of the plurality of nozzles includes a first section having a first length and a first size, and a second having a second length and a second size. The ratio of the second size to the first size is between 2 and 10.

Abstract: A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material, a distribution pipe with one or more outlets provided along the length of the distribution pipe, wherein the distribution pipe is in fluid communication with the evaporation crucible, and wherein the distribution pipe has a cross-section perpendicular to the length of the distribution pipe, which is non-circular, and which includes: an outlet side at which the one or more outlets are provided, wherein the width of the outlet side of the cross-section is 30% or less of the maximum dimension of the cross-section.

Abstract: An evaporation source array for depositing two or more organic materials on a substrate is described. The evaporation source array includes two or more evaporation crucibles, wherein the two or more evaporation crucibles are configured to evaporate the two or more organic materials, two or more distribution pipes with outlets provided along the length of the two or more distribution pipes, wherein a first distribution pipe of the two or more distribution pipes is in fluid communication with a first evaporation crucible of the two or more evaporation crucibles, two or more heat shields, which surround the first distribution pipe, a cooling shield arrangement provided at at least one side of the two or more distribution pipes, wherein the at least one side is the side at which the outlets are provided, and a cooling element provided at or in the cooling shield arrangement for active cooling of the cooling shield arrangement.

Abstract: A processing apparatus for processing devices, particularly devices including organic materials therein, is described. The processing apparatus includes a processing vacuum chamber; at least one evaporation source for organic material, wherein the at least one evaporation source includes at least one evaporation crucible, wherein the at least one evaporation crucible is configured to evaporate the organic material, and at least one distribution pipe with one or more outlets, wherein the at least one distribution pipe is in fluid communication with the at least one evaporation crucible; and a maintenance vacuum chamber connected with the processing vacuum chamber, wherein the at least one evaporation source can be transferred from the processing vacuum chamber to the maintenance vacuum chamber and from the maintenance vacuum chamber to the processing vacuum chamber.

Abstract: A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate is described. The depositing arrangement includes a first chamber configured for liquefying the material, wherein the first chamber comprises a gas inlet configured for inlet of a gas in the first chamber, an evaporation zone configured for vaporizing the liquefied material, a line providing a fluid communication between the first chamber and the evaporation zone for the liquefied material, wherein the line includes a first portion defining a flow resistance of the line, a valve configured for controlling the flow rate of the gas in the first chamber for controlling a flow rate of the liquefied material through the line having said flow resistance, and one or more outlets for directing the vaporized material towards the substrate.

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material; a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and a support for the distribution pipe, wherein the support is connectable to a first drive or includes the first drive, wherein the first drive is configured for a translational movement of the support and the distribution pipe.

Abstract: According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device includes a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion. The at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.

Abstract: A sputter deposition source for sputter deposition in a vacuum chamber is described. The source includes a wall portion of the vacuum chamber; a target providing a material to be deposited during the sputter deposition; an RF power supply for providing RF power to the target; a power connector for connecting the target with the RF power supply; and a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path through the conductor rod.

Abstract: The present invention refers to a method for coating a substrate, a coating apparatus for carrying out the method and a handling module for coating apparatuses. The handling module comprises a moveable support for a substrate to be coated the support being movable between at least two positions. Further, a mask arranging device for at least one of attaching and detaching a mask to the substrate, and a mask alignment device for aligning the mask with respect to the substrate are provided for, wherein the mask alignment device is attached to the movable support so as to be movable together with the support. Alternatively, the handling module comprises a vacuum chamber, a moveable support for a substrate to be coated, the support being arranged in the vacuum chamber and being rotatable between at least two positions, wherein a mask arranging device for at least one of attaching and detaching a mask to the substrate is arranged within the vacuum chamber of the handling module.

Abstract: A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate (4) is described. The arrangement a first chamber (110) configured for liquefying the material, a valve (130) being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve, an evaporation zone (114) being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material, and one or more outlets (116) for directing the vaporized material towards the substrate.

Abstract: To be able to realize a relatively wide magnetron sputter cathode, it is proposed that on the vacuum side of a carrier (2) is disposed the sputter target (4) with a backing plate (3), which maintains a gap (14) from the carrier (2). The backing plate (3) is developed as a cooling plate. In it are located cooling means channels (15), which, via an inlet (16) through the carrier (2), are supplied with cooling fluid, which can flow out again via an outlet (17) through the carrier (2). On the atmospheric side is located a magnet configuration (5).