Abstract: A beam control apparatus for an illumination beam includes an imaging illumination optical unit assembly for imaging an intermediate focus of the illumination beam onto an object field to be illuminated. A control component that influences a beam path of the illumination beam is displaceable in at least one degree of freedom by at least one displacement actuator. A position sensor device of the beam control apparatus detects a position of the intermediate focus. A control device of the beam control apparatus is signal-connected to the position sensor device and the displacement actuator. From an intermediate focus position signal received from the position sensor device, the control device calculates control signals for the displacement actuator and forwards the latter to the displacement actuator for controlling the position of the intermediate focus. This results in a beam control apparatus which makes well-controllable illumination possible together with a simple construction.

Abstract: A device for the optical measurement of an optical system, in particular an optical imaging system, is provided. The device includes at least one test optics component arranged on an object side or an image side of the optical system. An immersion fluid is adjacent to at least one of the test optics components. A container for use in this device, a microlithography projection exposure machine equipped with this device, and a method which can be carried out with the aid of this device are also provided. The device and method provide for optical measurement of microlithography projection objectives with high numerical apertures by using wavefront detection with shearing or point diffraction interferometry, or a Moiré measuring technique.

Abstract: A method for calibrating a specimen stage of a metrology system is provided, in which a specimen that has multiple marks is positioned successively in different calibration positions, each mark is positioned in the photography range of an optical system by means of the specimen stage in each calibration position of the specimen, and the mark position is measured using the optical system. A model is set up that describes positioning errors of the specimen stage using a system of functions having calibration parameters to be determined. The model takes into consideration at least one systematic measurement error that occurs during the measurement of the mark positions. The values of the calibration parameters are determined based on the model with consideration of the measured mark positions.

Abstract: There is provided a method for determining residual errors, compromising the following steps: in a first step, a test plate comprising a first pattern is used, and in a second step, a test plate comprising a second pattern which is reflected and/or rotated with respect to the first step is used.

Abstract: A device for the optical measurement of an optical system, in particular an optical imaging system, is provided. The device includes at least one test optics component arranged on an object side or an image side of the optical system. An immersion fluid is adjacent to at least one of the test optics components. A container for use in this device, a microlithography projection exposure machine equipped with this device, and a method which can be carried out with the aid of this device are also provided. The device and method provide for optical measurement of microlithography projection objectives with high numerical apertures by using wavefront detection with shearing or point diffraction interferometry, or a Moiré measuring technique.

Abstract: A device for the optical measurement of an optical system, in particular an optical imaging system, is provided. The device includes at least one test optics component arranged on an object side or an image side of the optical system. An immersion fluid is adjacent to at least one of the test optics components. A container for use in this device, a microlithography projection exposure machine equipped with this device, and a method which can be carried out with the aid of this device are also provided. The device and method provide for optical measurement of microlithography projection objectives with high numerical apertures by using wavefront detection with shearing or point diffraction interferometry, or a Moiré measuring technique.

Abstract: A method for calibrating a specimen stage of a metrology system is provided, in which a specimen that has multiple marks is positioned successively in different calibration positions, each mark is positioned in the photography range of an optical system by means of the specimen stage in each calibration position of the specimen, and the mark position is measured using the optical system. A model is set up that describes positioning errors of the specimen stage using a system of functions having calibration parameters to be determined. The model takes into consideration at least one systematic measurement error that occurs during the measurement of the mark positions. The values of the calibration parameters are determined based on the model with consideration of the measured mark positions.

Abstract: An apparatus for measuring the positions of marks on a mask is provided, said apparatus comprising a mask holder for holding the mask, a recording unit for recording the marks of the mask held by the mask holder, an actuating module for moving the mask holder and the recording unit relative to each other, and an evaluating module, which numerically calculates the gravity-induced sagging of the mask in the mask holder and determines the positions of the marks on the mask, based on the calculated sagging, the recordings made by the recording unit and the relative movement between the mask holder and the recording unit, wherein, prior to calculating said sagging, the present position of the mask in the mask holder is determined and is taken into consideration in said numerical calculation, and/or the geometrical dimensions of the mask are taken into consideration in said numerical calculation of sagging.

Abstract: There is provided a method for determining residual errors, compromising the following steps: in a first step, a test plate comprising a first pattern is used, and in a second step, a test plate comprising a second pattern which is reflected and/or rotated with respect to the first step is used.

Abstract: A device for the optical measurement of an optical system, in particular an optical imaging system, is provided. The device includes at least one test optics component arranged on an object side or an image side of the optical system. An immersion fluid is adjacent to at least one of the test optics components. A container for use in this device, a microlithography projection exposure machine equipped with this device, and a method which can be carried out with the aid of this device are also provided. The device and method provide for optical measurement of microlithography projection objectives with high numerical apertures by using wavefront detection with shearing or point diffraction interferometry, or a Moiré measuring technique.

Abstract: A device for the optical measurement of an optical system, in particular an optical imaging system, is provided. The device includes at least one test optics component arranged on an object side or an image side of the optical system. An immersion fluid is adjacent to at least one of the test optics components. A container for use in this device, a microlithography projection exposure machine equipped with this device, and a method which can be carried out with the aid of this device are also provided. The device and method provide for optical measurement of microlithography projection objectives with high numerical apertures by using wavefront detection with shearing or point diffraction interferometry, or a Moiré measuring technique.

Abstract: A device for the optical measurement of an optical system, in particular an optical imaging system, is provided. The device includes at least one test optics component arranged on an object side or an image side of the optical system. An immersion fluid is adjacent to at least one of the test optics components. A container for use in this device, a microlithography projection exposure machine equipped with this device, and a method which can be carried out with the aid of this device are also provided. The device and method provide for optical measurement of microlithography projection objectives with high numerical apertures by using wavefront detection with shearing or point diffraction interferometry, or a Moiré measuring technique.

Abstract: A method for determining at least one of distortion and de-focus for an optical imaging system. The method includes determining wavefront aberrations in a pupil plane of the optical imaging system by a wavefront measurement method, determining focus offset measured values in an xy-direction and/or z-direction for one or more different illumination settings by a test pattern measurement method with imaging and comparative evaluation of test patterns for the optical imaging system, and determining values for one or more aberration parameters that relate to the distortion and/or image surface from a prescribed relationship between the determined wavefront aberrations and the determined focus offset measured values.

Abstract: A phase shifting wavefront superimposition method in which the intensities of superimposition patterns of object wavefront and reference wavefronts produced successively in time with respective phase shifts by predefinable phase steps are registered for a respective predefinable location and, from the registered intensities, an object-induced phase difference between object wavefront and reference wavefront is determined for the respective location. Phase step errors in the successively produced superimposition patterns are determined by means of a spatial superimposition pattern evaluation and taken into account correctively in the determination of the object-induced phase difference. The method is used for example, in wavefront measurement of optical imaging systems by means of phase shifting interferometry for the purpose of highly accurate determination of imaging errors.

Abstract: In the case of a method and a measuring system for measuring the distortion of an optical imaging system with the aid of moiré patterns, an object grating with an object pattern is arranged in the object plane of the imaging system, and an image grating with an image pattern is arranged in the image plane of the imaging system. Both the object pattern and the image pattern in each case have a multiplicity of cells with sub-gratings of different grating properties, it being possible, in particular, for the sub-gratings to have different directions of periodicity and different phase angles.

Abstract: A method for determining at least one of distortion and de-focus for an optical imaging system. The method includes determining wavefront aberrations in a pupil plane of the optical imaging system by a wavefront measurement method, determining focus offset measured values in an xy-direction and/or z-direction for one or more different illumination settings by a test pattern measurement method with imaging and comparative evaluation of test patterns for the optical imaging system, and determining values for one or more aberration parameters that relate to the distortion and/or image surface from a prescribed relationship between the determined wavefront aberrations and the determined focus offset measured values.

Abstract: A device and a method for the optical measurement of an optical system (1), in particular an optical imaging system. The device includes one or more object-side test optics components (2a, 2b) arranged in front of the optical system to be measured, and/or one or more image-side test optics components (3, 4, 5) arranged behind the optical system to be measured. A container for use in such a device, a microlithography projection exposure machine equipped with such a device, and a method which can be carried out with the aid of this device are also disclosed. An immersion fluid is introduced adjacent to at least one of the one or more object-side test optics components and/or image-side test optics components. Such device and method provide for optical measurement by microlithography projection objectives of high numerical aperture using wavefront detection with shearing or point diffraction interferometry or a Moiré measuring technique.

Abstract: In the case of a method and a measuring system for measuring the distortion of an optical imaging system with the aid of moiré patterns, an object grating with an object pattern is arranged in the object plane of the imaging system, and an image grating with an image pattern is arranged in the image plane of the imaging system. Both the object pattern and the image pattern in each case have a multiplicity of cells with sub-gratings of different grating properties, it being possible, in particular, for the sub-gratings to have different directions of periodicity and different phase angles.

Abstract: In a moiré method for measuring the distortion of an optical imaging system in which and object grid having a two-dimensional object pattern is arranged in an object plane of the imaging system and an image grid having a two-dimensional image pattern is arranged in an image plane of the imaging system, these patterns are configured in the form of, for example cross-hatched patterns or checker board patterns, are adapted to suit one another such that a two-dimensional moiré fringe pattern that may be detected by a two-dimensional, spatially resolving, detection device is created when the object grid is imaged onto the image grid using the imaging system. Distortion components of the imaging system may be simultaneously determined along two differently oriented, in particular, two mutually orthogonal, image directions from a two-dimensional moiré fringe pattern.