Patents by Inventor Uwe Schulze

Uwe Schulze has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100249967
    Abstract: Metrology data associated with a plurality of workpieces processed at a selected operation in the process flow including a plurality of operations is retrieved. A processing context associated with each of the workpieces is determined. The processing context identifies at least one previous tool used to perform an operation on the associated workpiece prior to the selected operation. A plurality of performance metrics is determined for a plurality of tools capable of performing the selected operation based on the metrology data. Each performance metric is associated with a particular tool and a particular processing context. A set of the performance metrics is identified for the plurality of tools having a processing context matching a processing context of a selected workpiece awaiting performance of the selected operation. The selected workpiece is dispatched for processing in a selected one of the plurality of tools based on the set of performance metrics.
    Type: Application
    Filed: March 31, 2009
    Publication date: September 30, 2010
    Inventors: Robert Barlovic, Uwe Schulze, Jan Raebiger, Joerg Weigang, Jens Busch, Rolf Seltmann
  • Publication number: 20100216934
    Abstract: Method of grafting an anionic organic polymer to an organic polymer in latex form, which method comprises forming a water-based mixture of (1) a latex of an organic polymer, (2) an anionic organic polymer, and (3) a free radical initiator, and effecting grafting between said latex polymer and said anionic organic polymer characterized in that the anionic organic polymer is (i) an anionic homopolymer or anionic random copolymer wherein at least 50 mole % of the repeating units are repeating units that bear at least one acid group or acid salt group or (ii) a graft or block copolymer comprising a segment consisting of a anionic homopolymer or anionic random copolymer as defined in (i), and aqueous dispersion comprising graft polymer particles.
    Type: Application
    Filed: March 31, 2008
    Publication date: August 26, 2010
    Applicant: KEMIRA OYJ
    Inventors: Teppo Sahlberg, Jan-Luiken Hemmes, Jonni Ahlgren, Uwe Schulze, Claudia Eigen
  • Publication number: 20100161103
    Abstract: By controlling the flow rate of one or more gaseous components of an etch ambient during the formation of metal lines and vias on the basis of feedback measurement data from critical dimensions, process variations may be reduced, thereby enhancing performance and reliability of the respective metallization structure.
    Type: Application
    Filed: March 5, 2010
    Publication date: June 24, 2010
    Inventors: Matthias SCHALLER, Uwe SCHULZE, Mathias BARANYAI
  • Patent number: 7704889
    Abstract: By controlling the flow rate of one or more gaseous components of an etch ambient during the formation of metal lines and vias on the basis of feedback measurement data from critical dimensions, process variations may be reduced, thereby enhancing performance and reliability of the respective metallization structure.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: April 27, 2010
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Matthias Schaller, Uwe Schulze, Mathias Baranyai
  • Publication number: 20100028790
    Abstract: By taking into consideration the combination of the substrate holders in various lithography tools used during the imaging to two subsequent device layers, enhanced alignment accuracy may be accomplished. Furthermore, restrictive tool dedications for critical lithography processes may be significantly relaxed by providing specific overlay correction data for each possible process flow, wherein, in some illustrative embodiments, a restriction of the number of possible process flows may be accomplished by implementing a rule for selecting a predefined substrate holder when starting the processing of an associated group of substrates.
    Type: Application
    Filed: June 2, 2009
    Publication date: February 4, 2010
    Inventors: Rolf Seltmann, Jens Busch, Uwe Schulze
  • Patent number: 7618755
    Abstract: By automatically estimating the focus status of individual substrates or lots on the basis of focus-specific tool information obtained from the exposure tool, such as tilt angle ranges used during the automatic focusing procedures, possible hot spot errors may be detected highly efficiently prior to releasing the substrates to a subsequent etch process. Consequently, yield losses may be reduced. Moreover, possible error sources for hot spot errors may be identified.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: November 17, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Uwe Schulze, Jens Krause, Rolf Seltmann
  • Patent number: 7547561
    Abstract: An advanced process control (APC) architecture comprising a process model that incorporates a target offset term is provided. The APC architecture may be applied to a so-called develop inspect critical dimension (DICD) model using the target offset term to correct at least one exposure parameter on the occurrence of an abrupt event. A corresponding event may, for example, concern a modified reflectivity of processed substrates, for example due to a rework of substrates covered by amorphous carbon material.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: June 16, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Uwe Schulze, Martin Mazur, Andreas Becker
  • Patent number: 7542880
    Abstract: A method for estimating a state associated with a process includes receiving a state observation associated with the process. The state observation has an associated process time. A weighting factor to discount the state observation is generated based on the process time. A state estimate is generated based on the discounted state observation. A system includes a process tool, a metrology tool, and a process controller. The process tool is operable to perform a process in accordance with an operating recipe. The metrology tool is operable to generate a state observation associated with the process. The process controller is operable to receive the state observation, the state observation having an associated process time, generate a weighting factor to discount the state observation based on the process time, generate a state estimate based on the discounted state observation, and determine at least one parameter of the operating recipe based on the state estimate.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: June 2, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Richard P. Good, Kevin A. Chamness, Uwe Schulze
  • Publication number: 20080203791
    Abstract: A profile (9) which can be connected to a cover (4) serves to fasten the cover (4) on a supporting body (2). According to the invention, it is provided that the profile has a recess (17) for receiving a connecting region, in particular a seam (6), of cover segments (5.1, 5.2) of an at least two-piece cover.
    Type: Application
    Filed: May 20, 2006
    Publication date: August 28, 2008
    Inventors: Lars Hennig, Axel Posnien, Uwe Schulze
  • Patent number: 7403832
    Abstract: A controller and a method of controlling a process tool is provided, in which machine constants used for calibrating manipulated variables of the control algorithm are explicitly introduced into the process model, thereby providing an enhanced controller behavior immediately after the introduction of new measurement values of the machine constants.
    Type: Grant
    Filed: April 18, 2006
    Date of Patent: July 22, 2008
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Uwe Schulze, Uwe Knappe
  • Publication number: 20080057418
    Abstract: By taking into consideration tool-specific distortion signatures and reticle-specific placement characteristics in an alignment control system, the control quality of sophisticated APC strategies may be significantly enhanced. Respective correction data may be established on the basis of any combinations of tool/reticles and layers to be aligned to each other, which may modify the respective target values of alignment parameters used for controlling the alignment process on the basis of standard overlay measurement data obtained from dedicated overlay marks.
    Type: Application
    Filed: August 22, 2007
    Publication date: March 6, 2008
    Inventors: Rolf Seltmann, Bernd Schulz, Fritjof Hempel, Uwe Schulze
  • Publication number: 20070239285
    Abstract: A method for estimating a state associated with a process includes receiving a state observation associated with the process. The state observation has an associated process time. A weighting factor to discount the state observation is generated based on the process time. A state estimate is generated based on the discounted state observation. A system includes a process tool, a metrology tool, and a process controller. The process tool is operable to perform a process in accordance with an operating recipe. The metrology tool is operable to generate a state observation associated with the process. The process controller is operable to receive the state observation, the state observation having an associated process time, generate a weighting factor to discount the state observation based on the process time, generate a state estimate based on the discounted state observation, and determine at least one parameter of the operating recipe based on the state estimate.
    Type: Application
    Filed: April 6, 2006
    Publication date: October 11, 2007
    Inventors: Richard Good, Kevin Chamness, Uwe Schulze
  • Publication number: 20070178699
    Abstract: By controlling the flow rate of one or more gaseous components of an etch ambient during the formation of metal lines and vias on the basis of feedback measurement data from critical dimensions, process variations may be reduced, thereby enhancing performance and reliability of the respective metallization structure.
    Type: Application
    Filed: October 5, 2006
    Publication date: August 2, 2007
    Inventors: Matthias Schaller, Uwe Schulze, Mathias Baranyai
  • Patent number: 7233835
    Abstract: An APC controller is configured to operate on a segregated data structure during its normal operation and to establish a control state during an initializing event for a non-initialized manufacturing context on the basis of other initialized or non-initialized manufacturing contexts. Thus, the processing of pilot substrates may be reduced or the processing of the pilot substrates may be initiated on the basis of reliably established process parameters.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: June 19, 2007
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Richard Paul Good, Uwe Schulze
  • Publication number: 20070084047
    Abstract: A method is for repairing and/or modifying component parts of a gas turbine. First, at least one, particularly damaged section of the component part that is to be repaired is cut out of the component part. In addition, if it does not exist, a data record is generated for a replacement part that is to be produced. The replacement part is subsequently produced with the aid of a rapid manufacturing process. Subsequently, the replacement part produced is integrated into the component part that is to be repaired.
    Type: Application
    Filed: April 1, 2004
    Publication date: April 19, 2007
    Applicant: MTU AERO ENGINES GMBH
    Inventors: Anja Lange, Jens Lange, Uwe Schulze
  • Patent number: 7200455
    Abstract: The present invention relates to a method of run-to-run control of a manufacturing process. A plurality of runs of the manufacturing process is performed. In each of the runs, a value of a process input is applied to the manufacturing process. A measured value of a process output of the respective run is determined. A process input quantity is calculated based on the measured value, the applied process input, a target value of the process output and at least one value of a sensitivity parameter. The sensitivity parameter describes a variation of the process output caused by a variation of the process input. The process input applied in a subsequent one of the plurality of runs is based on the process input quantity. The sensitivity parameter is modified between at least one pair of the runs of the manufacturing process.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: April 3, 2007
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Uwe Schulze
  • Publication number: 20070048635
    Abstract: By automatically estimating the focus status of individual substrates or lots on the basis of focus-specific tool information obtained from the exposure tool, such as tilt angle ranges used during the automatic focusing procedures, possible hot spot errors may be detected highly efficiently prior to releasing the substrates to a subsequent etch process. Consequently, yield losses may be reduced. Moreover, possible error sources for hot spot errors may be identified.
    Type: Application
    Filed: May 23, 2006
    Publication date: March 1, 2007
    Inventors: UWE SCHULZE, JENS KRAUSE, ROLF SELTMANN
  • Publication number: 20070027568
    Abstract: An APC controller is configured to operate on a segregated data structure during its normal operation and to establish a control state during an initializing event for a non-initialized manufacturing context on the basis of other initialized or non-initialized manufacturing contexts. Thus, the processing of pilot substrates may be reduced or the processing of the pilot substrates may be initiated on the basis of reliably established process parameters.
    Type: Application
    Filed: May 12, 2006
    Publication date: February 1, 2007
    Inventors: Richard Good, Uwe Schulze
  • Publication number: 20060271225
    Abstract: A controller and a method of controlling a process tool is provided, in which machine constants used for calibrating manipulated variables of the control algorithm are explicitly introduced into the process model, thereby providing an enhanced controller behavior immediately after the introduction of new measurement values of the machine constants.
    Type: Application
    Filed: April 18, 2006
    Publication date: November 30, 2006
    Inventors: Uwe Schulze, Uwe Knappe
  • Publication number: 20060223203
    Abstract: An advanced process control (APC) architecture comprising a process model that incorporates a target offset term is provided. The APC architecture may be applied to a so-called develop inspect critical dimension (DICD) model using the target offset term to correct at least one exposure parameter on the occurrence of an abrupt event. A corresponding event may, for example, concern a modified reflectivity of processed substrates, for example due to a rework of substrates covered by amorphous carbon material.
    Type: Application
    Filed: November 17, 2005
    Publication date: October 5, 2006
    Inventors: Uwe Schulze, Martin Mazur, Andreas Becker