Abstract: A multiple insertion head for mounting components onto substrates includes a carrier configured to rotate about a rotational axis, a plurality of active drives, and a plurality of receiving tools configured to move in a mounting direction at an angle to the rotational axis. The receiving tools are arranged on the carrier so as to receive the components. Each receiving tool is permanently coupled to one of the active drives.

Abstract: The invention relates to a multiple insertion head for mounting components onto substrates, the insertion head including a carrier which is arranged in such a way that it can rotate about a rotational axis and is provided with many receiving tools that are arranged in such a way that they can be displaced in a mounting direction at an angle to the rotational axis, the receiving tools being used to receive the components. Each receiving tool is provided with at least one active drive and/or sensor, ensuring that the components are rapidly positioned with the highest precision.

Abstract: The invention relates to a multiple insertion head for mounting components (300) onto substrates, said insertion head comprising a carrier (200) which is arranged in such a way that it can rotate about a rotational axis (D) and is provided with a plurality of receiving tools (210) that are arranged in such a way that they can be displaced in a mounting direction at an angle to the rotational axis (D), said receiving tools being used to receive the components (300). Each receiving tool (210) is provided with at least one active drive and/or sensor, ensuring that the components (300) are rapidly positioned with the highest precision.