Abstract: A printed circuit board assembly includes a printed circuit board having an upper side and a lower side, and an electrical module having an upper side and a lower side. The upper side of the electrical module is electrically connected to the lower side of the printed circuit board. For the electrical module to make electrical contact, the electrical module has electrical contacts on the upper side of the electrical module. An underfill material is arranged between the upper side of the electrical module and the lower side of the printed circuit board in an area next to the electrical contacts. Each of the electrical contacts is arranged adjacent to a side edge of the upper side of the electrical module, and an edge gap between the respective electrical contact and the adjacent side edge is sealed by an edge bond material.

Abstract: A printed circuit board assembly comprising a printed circuit board having a top side and an underside, electrical modules having a top side and an underside, a heat sink that is thermally coupled with the underside of the electrical modules, and a hold-down device. The heat sink has a structured top side that includes a plurality of cavities and bearing structures arranged between the cavities and forming a bearing surface for the printed circuit board. The underside of the printed circuit board lies on the bearing surface and the region of the underside that is lying on the bearing surface forms a bottom abutment surface, the electrical modules project into the cavities of the heat sink, and the hold-down device has projecting structures against the top side of the printed circuit board at contact points located opposite the bottom abutment surface and apply a hold-down force to the contact points.

Abstract: A power electronics converter may include: a converter commutation cell having a power circuit and a gate driver circuit, the power circuit including at least one power semiconductor switching element and at least one capacitor, wherein each power semiconductor switching element is embedded in a solid insulating material, wherein each power semiconductor switching element has at least three terminals including a gate terminal, wherein the gate driver circuit is electrically connected to and configured to provide switching signals to the gate terminal of each power semiconductor switching element, wherein a peak rated power output of the power electronics converter is greater than 25 KW, and wherein a total rated capacitance of the power circuit of the converter commutation cell divided by the peak rated power output of the power electronics converter is less than or equal to 5 nF/W.

Abstract: A printed circuit board assembly includes a printed circuit board with an upper face, a lower face, multiple metal layers, and multiple electrically insulating layers. The printed circuit board assembly additionally includes a metal heat sink on which the lower face of the printed circuit board lies at least in some regions, wherein the metal heat sink has a heat sink potential. The bottom metal layer of the printed circuit board is set to the heat sink potential while the other metal layers of the printed circuit board have an electric potential which deviates therefrom.

Abstract: An electrical module and a circuit board arrangement including an electrical module are disclosed. The electrical module includes an upper side and an underside, the upper side having four rectangularly arranged side edges, an electrical component embedded in the electrical module, and at least three electrical solder pads formed on the upper side configured to make electrical contact with the electrical component and configured to come into contact with an associated electrical solder pad of a circuit board via a solder layer. The solder pads of the electrical module are arranged in a symmetrical arrangement on the upper side of the electrical module, and/or the solder pads are arranged axially symmetrically on the upper side of the electrical module, and/or the solder pads extend along two opposite side edges on the upper side of the electrical module.

Abstract: A power electronics converter may include: a first multi-layer planar carrier substrate having one or more electrically conductive layers; a second multi-layer planar carrier substrate having one or more electrically conductive layers; a converter commutation cell circuit including a plurality of commutation cell components that are electrically connected together via the one or more electrically conductive layers of the first planar carrier substrate and electrical connections, the commutation cell components including one or more power semiconductor switching elements in one or more power semiconductor prepackages, each power semiconductor prepackage including a power semiconductor switching element embedded in a solid insulating material; one or more additional converter components electrically connected to the one or more electrically conductive layers of the second planar carrier substrate; and one or more further electrical connections connecting together one or more of the electrically conductive layer

Abstract: A method of designing and manufacturing a power electronics converter for an electrical power system is provided. A circuit design for the power electronics converter is selected. A shape constraint for integrating the power electronics converter into the electrical power system is determined, and at least one multi-layer carrier substrate is obtained according to the determined shape constraint. A plurality of power semiconductor prepackages are obtained. Each power semiconductor prepackage includes a power semiconductor switching element embedded in a solid insulating material and an electrical connection extending through the solid insulating material from a terminal of the power semiconductor switching element to a connection surface of the prepackage.

Abstract: The disclosure relates to an electronic device including a thermally and electrically conductive transmission element configured to dissipate heat from a heat source, wherein the transmission element is at a first electric potential and includes rounded edges. The electronic device further includes a heat sink at a second electric potential and an electrically insulating layer arranged between the heat sink and the transmission element in order to connect the transmission element to the heat sink in a thermally conductive manner.

Abstract: A circuit board assembly includes: a circuit board having an upper side and a lower side; at least one electrical component arranged on the lower side of the circuit board; a heat sink; and a hold-down device, wherein the hold-down device presses the circuit board against the heat sink. Furthermore, the hold-down device is configured to be spring-loaded and exert a spring force on the circuit board.

Abstract: A power electronics converter includes a substrate and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is comprised in a power semiconductor prepackage. An electrical connection side of the respective power semiconductor prepackage is spaced apart in a z direction from the substrate so as to define a prepackage gap between the substrate and the electrical connection side. At least a portion of the prepackage gap is filled with an electrically insulating material having voids. A converter parameter ? defined as an insulation fill factor divided by a maximum void size is greater than or equal to 10/mm. The insulation fill factor is defined as a cumulated volume of the voids subtracted from a volume of the electrically insulating material divided by the volume of the electrically insulating material.

Abstract: A printed circuit board assembly includes a printed circuit board having an upper side and a lower side, an electrical module having an upper side and a lower side, and a holding down construction. The upper side of the electrical module is arranged on the lower side of the printed circuit board. The holding down construction includes screwing posts that are configured to be screwed against the printed circuit board. The holding down construction is arranged on the upper side of the printed circuit board and includes contact structures that are at a distance from the screwing posts and configured to rest or press on the printed circuit board at specific contact points only. The printed circuit board includes dedicated support points that correspond to the specific contact points of the holding down construction and are contacted by the specific contact points. The dedicated support points are mechanically reinforced.

Abstract: A power electronics converter includes a multi-layer planar carrier substrate and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element. Each power semiconductor switching element is included in a power semiconductor prepackage. One or more terminals of the power semiconductor switching element are connected to at least one conductive layer of the multi-layer planar carrier substrate at an electrical connection side of the power semiconductor prepackage. The electrical connection side is spaced apart in a z-direction from the carrier substrate by a prepackage gap. A peak rated power output of the power electronics converter is greater than or equal to 25 kW, and a converter parameter ?, which is defined as a size in the z-direction of the prepackage gap divided by a maximum electric field strength in the prepackage gap, is less than or equal to 300 pm2/V.

Abstract: A circuit board includes a plurality of circuit board layers arranged one on top of the other, wherein through-holes are integrated in the circuit board, wherein the through-holes are configured to receive metal screws that screw the circuit board to a heat sink. Insulating sleeves made of an insulating material are integrated into the circuit board, wherein the through-holes are formed in the circuit board in the region of the insulating sleeves.

Abstract: A power electronics converter includes a substrate and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is comprised in a power semiconductor prepackage. An electrical connection side of the respective power semiconductor prepackage is spaced apart in a z direction from the substrate so as to define a prepackage gap between the substrate and the electrical connection side. At least a portion of the prepackage gap is filled with an electrically insulating material having voids. A converter parameter ? defined as an insulation fill factor divided by a maximum void size is greater than or equal to 10/mm. The insulation fill factor is defined as a cumulated volume of the voids subtracted from a volume of the electrically insulating material divided by the volume of the electrically insulating material.

Abstract: A power electronics converter includes a multi-layer planar carrier substrate and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element. Each power semiconductor switching element is included in a power semiconductor prepackage. One or more terminals of the power semiconductor switching element are connected to at least one conductive layer of the multi-layer planar carrier substrate at an electrical connection side of the power semiconductor prepackage. The electrical connection side is spaced apart in a z-direction from the carrier substrate by a prepackage gap. A peak rated power output of the power electronics converter is greater than or equal to 25 kW, and a converter parameter ?, which is defined as a size in the z-direction of the prepackage gap divided by a maximum electric field strength in the prepackage gap, is less than or equal to 300 pm2/V.

Abstract: A circuit board is disclosed that includes a plurality of circuit board layers located one on top of the other. The plurality of circuit board layers includes a topmost circuit board layer and a bottommost circuit board layer, wherein the topmost circuit board layer forms a top of the circuit board, wherein the bottommost circuit board layer forms a bottom of the circuit board, and wherein the plurality of circuit board layers together forms an end circuit-board edge that runs perpendicularly to the top and the bottom of the circuit board. The end circuit-board edge is provided with a coating made of an insulating material.

Abstract: A power electronics converter includes a substrate and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is comprised in a power semiconductor prepackage. An electrical connection side of the respective power semiconductor prepackage is spaced apart in a z direction from the substrate so as to define a prepackage gap between the substrate and the electrical connection side. At least a portion of the prepackage gap is filled with an electrically insulating material having voids. A converter parameter ? defined as an insulation fill factor divided by a maximum void size is greater than or equal to 10/mm. The insulation fill factor is defined as a cumulated volume of the voids subtracted from a volume of the electrically insulating material divided by the volume of the electrically insulating material.

Abstract: A power electronics converter may include a converter commutation cell having a power circuit and a gate driver circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is included in a power semiconductor prepackage, each prepackage including one or more power semiconductor switching elements embedded in a solid insulating material, each power semiconductor switching element having at least three terminals including a gate terminal. The gate driver circuit is electrically connected to and configured to provide switching signals to the gate terminal of each of the at least one power semiconductor switching element. A peak rated power output of the power electronics converter is greater than 25 kW and a value of a converter parameter ? is greater than or equal to 0.5 PV/FH.

Abstract: An electrical module and a method of producing such an electrical module are disclosed. The electrical module includes: a ceramic circuit carrier, an electrical component arranged on the ceramic circuit carrier, and a substrate having a potting material, wherein the ceramic circuit carrier and the electrical component are arranged in the substrate. The electrical module has an upper side that forms electrical contact areas. and stepped metal structures arranged on the upper side of the electrical module. Each metal structure has regions of different thickness. The metal structures form on their upper side in each case one of the electrical contact areas of the electrical module and contact on their underside in a region of increased thickness in each case one of the electrical contacts on the upper side of the electrical component.

Abstract: A circuit board arrangement includes a circuit board having an upper side and an underside, and an electrical module, having an upper side and an underside, that is arranged with its upper side on the underside of the circuit board. The circuit board arrangement also includes a heat sink, means for providing a pressure, with which the underside of the electrical module is pressed against the heat sink, and a heat-conducting material that is arranged between the underside of the electrical module and the heat sink. The at least one electrical module is embedded in an encapsulating material that terminates with the underside of the electrical module without covering the underside of the electrical module. The encapsulating material is provided and configured to press the heat-conducting material against the heat sink in a region adjacent to the electrical module.