Abstract: A heat dissipating device. The heat dissipating device includes a receiving area open on at least one side, and a mosaic segment, arranged in the receiving area, which includes a thermally conductive and elastic compensation element and a thermally conductive low-adherent contact region. The thermally conductive and elastic compensation element rests against the inner surface of the base of the receiving area. The thermally conductive low-adherent contact region at least partly protrudes out of the receiving area at the open face of the receiving area lying opposite the base. The outer surface of the base of the receiving area forms a rigid first contact surface for a heat source or a heat sink, and the thermally conductive low-adherent contact region of the at least one mosaic segment forms a flexible second contact surface for the heat sink or the source.