Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.

Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.

Abstract: Assemblies of aligned tape automated bonding frames on a substrate, and a method of aligning a tape automated bonding frame to connection sites on the substrate. The method includes photolithographically patterning and etching metal to form a first pattern of signal leads and a second pattern of alignment leads. A semiconductor chip is bonded to the inner lead ends of the first pattern. Metal on a substrate is photolithographically patterned and etched to provide a third pattern of substrate connection sites and a fourth pattern of registration pads. The fourth pattern of registration pads has geometric and dimensional features which precisely correspond to those of the alignment leads. Moreover, the spatial relationship of the third and fourth patterns correspond to the spatial relationship of the first and second patterns. The corresponding geometric and dimensional features of the second and fourth patterns are aligned, whereafter the registration pads and the alignment leads are soldered together.

Abstract: A method for producing superconductor wire characterized by forming a solid superconductor preform, suspending the preform within an oven such that a portion of it is heated to approximately its melting point, and drawing on the melted portion of the preform to form a superconductor wire. If the preform is solid, so is the drawn wire, and if the preform is hollow, the drawn wire becomes a capillary. Superconductor wires can be intertwined, or can be intertwined with ordinary conductive wires or non-conductive tubing to form superconductor cables. A superconductor transmission line is made by coating a copper tube with subsequent superconductor, insulating, and protective layers.

Abstract: A process is disclosed for producing superconductor films on a variety of substrates, and more particularly a patterned superconductor film on a planar substrate. The basic process includes the steps of: 1) depositing a metal film of superconductor precursor elements on a substrate; 2) patterning the metal film; and 3) oxidizing the metal film to form a superconductor film. Because the process separates the metal precursor film formation, patterning, and oxidation steps, each of the steps can be individually optimized.

Abstract: Assemblies of aligned tape automated bonding frames on a substrate, and a method of aligning a tape automated bonding frame to connection sites on the substrate. The method includes photolithographically patterning and etching metal to form a first pattern of signal leads and a second pattern of alignment leads. A semiconductor chip is bonded to the inner lead ends of the first pattern. Metal on a substrate is photolithographically patterned and etched to provide a third pattern of substrate connection sites and a fourth pattern of registration pads. The fourth pattern of registration pads has geometric and dimensional features which precisely correspond to those of the alignment leads. Moreover, the spatial relationship of the third and fourth patterns correspond to the spatial relationship of the first and second patterns. The corresponding geometric and dimensional features of the second and fourth patterns are aligned, whereafter the registration pads and the alignment leads are soldered together.

Abstract: An interconnection system and method for linking electronic devices such as semiconductor chips. Inner leads of a tape automated bonding frame are aligned with pads on the semiconductor chip. Inner lead bonding fixes the lead frame to the chip. Outer leads of the tape automated bonding frame are brought into an overlapping relationship with conductive traces on a substrate. Rather than microbonding the outer leads to the traces of the substrate, bond wires are attached to the outer leads and the traces, thereby allowing electrical communication of input and output signals therebetween. In one embodiment, the tensile strength of the bond wires is greater than that of the outer leads. In a second embodiment, the bond strength of the wire to the outer lead is greater than the bond strength of the wire to the substrate trace.

Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.

Abstract: A method for producing insulated superconductor wire including the steps of a tubular glass preform, filling it with a superconductor material, suspending the preform within an oven to heat a section of the preform to approximately its softening point, and drawing the softened preform into a superconductor wire. A plastic coating can be applied to the wire to increase its durability. The completed wire preferably includes a superconductor core having its superconductor phase aligned with the longitudinal axis of the wire, a glass coating over the superconductor core, and a plastic coating over the glass coating.

Abstract: A process is disclosed for producing superconductor films on a variety of substrates, and more particularly a patterned superconductor film on a planar substrate. The basic process includes the steps of: 1) depositing a metal film of superconductor precursor elements on a substrate; 2) patterning the metal film; and 3) oxidizing the metal film to form a superconductor film. Because the process separates the metal precursor film formation, patterning, and oxidation steps, each of the steps can be individually optimized.