Patents by Inventor V Wade SINGLETON

V Wade SINGLETON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-destructive gap metrology
    Patent number: 11913772
    Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: February 27, 2024
    Assignee: Intel Corporation
    Inventors: Jianyong Mo, V Wade Singleton, Yiren Wu, Liang Zhang, David Wasinger
  • NON-DESTRUCTIVE GAP METROLOGY
    Publication number: 20230296371
    Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.
    Type: Application
    Filed: March 17, 2022
    Publication date: September 21, 2023
    Inventors: Jianyong MO, V Wade SINGLETON, Yiren WU, Liang ZHANG, David WASINGER