Patents by Inventor Vaddoarahalli K. Nagesh

Vaddoarahalli K. Nagesh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects
    Patent number: 5426405
    Abstract: A family of modular hybrid assemblies with high frequency interconnections is effected by a high frequency circuit assembly attached to a motherboard. Each assembly comprises standardized conducting elements and customizable transitions and circuit regions. The customizable transitions can be placed anywhere along the conducting element and are capable of low and high frequency performance. Attachment of the assembly can be effected via a standardized clamping structure which compresses an elastomeric member upon the conducting elements or by bending the conducting elements and soldering on end to attachment sites on the motherboard. Each member of the family of modular hybrid assemblies provides a controlled impedance transition from a transmission line on the circuit assembly to a transmission line on the motherboard.
    Type: Grant
    Filed: December 29, 1994
    Date of Patent: June 20, 1995
    Assignee: Hewlett-Packard Company
    Inventors: Daniel J. Miller, Kim H. Chen, Lewis R. Dove, Vaddoarahalli K. Nagesh